Some content of this application is unavailable at the moment.
If this situation persist, please contact us atFeedback&Contact
1. (WO2019045880) WAFERS HAVING III-NITRIDE AND DIAMOND LAYERS
Latest bibliographic data on file with the International Bureau    Submit observation

Pub. No.: WO/2019/045880 International Application No.: PCT/US2018/041172
Publication Date: 07.03.2019 International Filing Date: 08.07.2018
IPC:
H01L 21/02 (2006.01) ,H01L 21/78 (2006.01)
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21
Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
02
Manufacture or treatment of semiconductor devices or of parts thereof
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21
Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
70
Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in or on a common substrate or of specific parts thereof; Manufacture of integrated circuit devices or of specific parts thereof
77
Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
78
with subsequent division of the substrate into plural individual devices
Applicants:
RFHIC CORPORATION [US/US]; 920 Morrisville Pkwy Morrisville, North Carolina 27560, US
Inventors:
CHO, Sam Yul; US
LEE, Won Sang; US
Agent:
PARK, Chung Sik; US
Priority Data:
15/693,33331.08.2017US
Title (EN) WAFERS HAVING III-NITRIDE AND DIAMOND LAYERS
(FR) PLAQUETTES AYANT DES COUCHES DE NITRURE III ET DE DIAMANT
Abstract:
(EN) Wafers (1309) including a diamond layer (1306) and a semiconductor layer (1310) having III-Nitride compounds and methods for fabricating the wafers (1309) are provided. A first SiC layer (1304) is formed on a silicon substrate (1302), and using a carbon containing gas, a surface of the first SiC layer (1304) is carbonized to form carbon particles on the SiC layer. Then, a diamond layer (1306) is grown on the carbonized surface, where the carbon atoms act as seed particles for growing the diamond layer. A second SiC layer (1308) is formed on the diamond layer (1306) and a semiconductor layer (1310) having III-Nitride compounds is formed on the second SiC layer (1308). Then, the silicon substrate (1302) and the first SiC layer (1304) are removed.
(FR) L'invention concerne des plaquettes (1309) comprenant une couche de diamant (1306) et une couche semi-conductrice (1310) ayant des composés de nitrure III, et des procédés de fabrication des plaquettes (1309). Une première couche de SiC (1304) est formée sur un substrat de silicium (1302), et à l'aide d'un gaz contenant du carbone, une surface de la première couche de SiC (1304) est carbonisée pour former des particules de carbone sur la couche de SiC. Ensuite, une couche de diamant (1306) est développée sur la surface carbonisée, où les atomes de carbone agissent en tant que particules de germe pour faire croître la couche de diamant. Une seconde couche de SiC (1308) est formée sur la couche de diamant (1306), et une couche semi-conductrice (1310) ayant des composés de nitrure III est formée sur la seconde couche de SiC (1308). Ensuite, le substrat de silicium (1302) et la première couche de SiC (1304) sont retirés.
front page image
Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JO, JP, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: English (EN)
Filing Language: English (EN)