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1. (WO2019045755) METAL INTERCONNECTS, DEVICES, AND METHODS
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Pub. No.: WO/2019/045755 International Application No.: PCT/US2017/049938
Publication Date: 07.03.2019 International Filing Date: 01.09.2017
IPC:
H01L 21/768 (2006.01)
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21
Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
70
Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in or on a common substrate or of specific parts thereof; Manufacture of integrated circuit devices or of specific parts thereof
71
Manufacture of specific parts of devices defined in group H01L21/7086
768
Applying interconnections to be used for carrying current between separate components within a device
Applicants:
INTEL CORPORATION [US/US]; 2200 Mission College Boulevard Santa Clara, California 95054, US
Inventors:
ZIERATH, Daniel; US
MUKHERJEE, Srijit; US
FARMER, Jason; US
GANPULE, Chandan; US
LIN, Julia; US
Agent:
GRIFFIN, Malvern, U. III; US
CHAN, Christopher J.; US
ZOGAIB, Nash M.; US
BRANSON, Joshua W.; US
SEEGER, Richard A.; US
ARONSON, Joshua B.; US
Priority Data:
Title (EN) METAL INTERCONNECTS, DEVICES, AND METHODS
(FR) INTERCONNEXIONS MÉTALLIQUES, DISPOSITIFS ET PROCÉDÉS
Abstract:
(EN) Provided herein are metal interconnects that may include a cobalt alloy, a nickel alloy, or nickel. Also provided herein are methods of making metal interconnects. The metal interconnects may include a barrier and/or adhesion layer, a seed layer, a fill material, a cap, or a combination thereof, and at least one of the barrier and/or adhesion layer, the seed layer, the fill material, or the cap may include a cobalt alloy, a nickel alloy, nickel, or a combination thereof.
(FR) La présente invention concerne des interconnexions métalliques qui peuvent comprendre un alliage de cobalt, un alliage de nickel ou du nickel. L'invention concerne également des procédés de réalisation d'interconnexions métalliques. Les interconnexions métalliques peuvent comprendre une couche de barrière et/ou d'adhérence, une couche de germe, un matériau de remplissage, un capuchon, ou une combinaison de ceux-ci, et au moins l'une de la couche de barrière et/ou d'adhérence, la couche de germe, le matériau de remplissage, ou le capuchon peut comprendre un alliage de cobalt, un alliage de nickel, du nickel ou une combinaison de ceux-ci.
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Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JO, JP, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: English (EN)
Filing Language: English (EN)