Some content of this application is unavailable at the moment.
If this situation persist, please contact us atFeedback&Contact
1. (WO2019045642) INTEGRATED CIRCUIT MODULES AND SMART CARDS INCORPORATING THE SAME
Latest bibliographic data on file with the International Bureau    Submit observation

Pub. No.: WO/2019/045642 International Application No.: PCT/SG2018/050074
Publication Date: 07.03.2019 International Filing Date: 15.02.2018
Chapter 2 Demand Filed: 14.05.2018
IPC:
G06K 19/077 (2006.01) ,H05K 7/02 (2006.01)
G PHYSICS
06
COMPUTING; CALCULATING; COUNTING
K
RECOGNITION OF DATA; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
19
Record carriers for use with machines and with at least a part designed to carry digital markings
06
characterised by the kind of the digital marking, e.g. shape, nature, code
067
Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards
07
with integrated circuit chips
077
Constructional details, e.g. mounting of circuits in the carrier
H ELECTRICITY
05
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
K
PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
7
Constructional details common to different types of electric apparatus
02
Arrangements of circuit components or wiring on supporting structure
Applicants:
SMARTFLEX TECHNOLOGY PTE LTD [SG/SG]; 27 Ubi Road 4, #04-01 Singapore 408618, SG
Inventors:
NG, Eng Seng; SG
PANG, Sze Yong; SG
HENG, Cheng Kim; SG
Agent:
AMICA LAW LLC; 30 Raffles Place, #14-01 Chevron House Singapore 048622, SG
AMICA LAW LLC; 30 Raffles Place #14-01 Chevron House Singapore 048622 Singapore 048622, SG
Priority Data:
PCT/SG2017/05042328.08.2017SG
Title (EN) INTEGRATED CIRCUIT MODULES AND SMART CARDS INCORPORATING THE SAME
(FR) MODULES DE CIRCUIT INTÉGRÉ ET CARTES INTELLIGENTES INCORPORANT LESDITS MODULES DE CIRCUIT INTÉGRÉ
Abstract:
(EN) Embodiments of the invention provide an integrated chip (IC) module having contact pads which are accessible by single-bond holes and module-side antenna contact pads which are accessible by multi-bond holes. Each multi-bond hole is apportioned by an encapsulation into adjoining bonding channels for separately receiving wire bond(s) and antenna-connecting element. Each module-side antenna contact pad is apportioned by the encapsulation into adjoining but electrically connected bonding areas to allow establishment of electrical connection of both wire bond(s) and antenna-connecting element to an IC chip. The first and the second bonding area are partitioned from each other, by the encapsulant, without requiring a presence of substrate therebetween.
(FR) Selon des modes de réalisation, l'invention concerne un module de puce intégré (CI) ayant des plages de contact qui sont accessibles par des trous de liaison simple et des plages de contact d'antenne côté module qui sont accessibles par des trous de liaison multiple. Chaque trou de liaison multiple est réparti par une encapsulation dans des canaux de liaison adjacents pour recevoir séparément une ou plusieurs liaisons filaires et un élément de connexion d'antenne. Chaque plage de contact d'antenne côté module est répartie par l'encapsulation dans des zones de liaison adjacentes mais connectées électriquement pour permettre l'établissement d'une connexion électrique de la ou des liaisons filaires et de l'élément de connexion d'antenne à une puce de circuit intégré. La première et la seconde zone de liaison sont séparées l'une de l'autre, par l'agent d'encapsulation, sans nécessiter une présence de substrat entre elles.
front page image
Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JO, JP, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: English (EN)
Filing Language: English (EN)