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1. (WO2019045638) INTEGRATED CIRCUIT MODULES AND SMART CARDS INCORPORATING THE SAME
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Pub. No.: WO/2019/045638 International Application No.: PCT/SG2017/050423
Publication Date: 07.03.2019 International Filing Date: 28.08.2017
IPC:
G06K 19/077 (2006.01)
G PHYSICS
06
COMPUTING; CALCULATING; COUNTING
K
RECOGNITION OF DATA; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
19
Record carriers for use with machines and with at least a part designed to carry digital markings
06
characterised by the kind of the digital marking, e.g. shape, nature, code
067
Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards
07
with integrated circuit chips
077
Constructional details, e.g. mounting of circuits in the carrier
Applicants:
SMARTFLEX TECHNOLOGY PTE LTD [SG/SG]; 27 Ubi Road 4, #04-01 Singapore 408618, SG
Inventors:
NG, Eng Seng; SG
PANG, Sze Yong; SG
HENG, Cheng Kim; SG
Agent:
AMICA LAW LLC; 30 Raffles Place #14-01 Chevron House Singapore 048622, SG
Priority Data:
Title (EN) INTEGRATED CIRCUIT MODULES AND SMART CARDS INCORPORATING THE SAME
(FR) MODULES DE CIRCUIT INTÉGRÉ ET CARTES INTELLIGENTES LES INTÉGRANT
Abstract:
(EN) Embodiments of the invention provide an integrated chip (IC) module having contact pads which are accessible by single-bond holes and module-side antenna contact pads which are accessible by multi-bond holes. Each multi-bond hole is apportioned by an encapsulation into adjoining bonding channels for separately receiving wire bond(s) and antenna-connecting element. Each module-side antenna contact pad is apportioned by the encapsulation into adjoining but electrically connected bonding areas to allow establishment of electrical connection of both wire bond(s) and antenna-connecting element to an IC chip.
(FR) L'invention, selon certains modes de réalisation, concerne un module de puce intégré (CI) comportant des plages de contact qui sont accessibles par des trous à liaison simple et des plages de contact d'antenne côté module qui sont accessibles par des trous à liaisons multiples. Chaque trou à liaisons multiples est réparti par une encapsulation en canaux de liaison adjacents destinés à recevoir séparément une ou plusieurs liaisons filaires et un élément de connexion d'antenne. Chaque plage de contact d'antenne côté module est répartie par l'encapsulation en zones de liaison adjacentes mais connectées électriquement pour permettre l'établissement d'une connexion électrique d'une ou de plusieurs liaisons filaires et de l'élément de connexion d'antenne à une puce de circuit intégré.
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Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JO, JP, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: English (EN)
Filing Language: English (EN)