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1. (WO2019045506) LIGHT EMITTING DEVICE PACKAGE AND LIGHT SOURCE DEVICE
Latest bibliographic data on file with the International Bureau    Submit observation

Pub. No.: WO/2019/045506 International Application No.: PCT/KR2018/010113
Publication Date: 07.03.2019 International Filing Date: 31.08.2018
IPC:
H01L 33/48 (2010.01) ,H01L 33/20 (2010.01) ,H01L 33/52 (2010.01) ,H01L 33/62 (2010.01) ,F21K 9/00 (2016.01)
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
33
Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
48
characterised by the semiconductor body packages
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
33
Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
02
characterised by the semiconductor bodies
20
with a particular shape, e.g. curved or truncated substrate
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
33
Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
48
characterised by the semiconductor body packages
52
Encapsulations
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
33
Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
48
characterised by the semiconductor body packages
62
Arrangements for conducting electric current to or from the semiconductor body, e.g. leadframe, wire-bond or solder balls
[IPC code unknown for F21K 9]
Applicants:
엘지이노텍 주식회사 LG INNOTEK CO., LTD. [KR/KR]; 서울시 중구 후암로 98 98, Huam-ro Jung-gu Seoul 04637, KR
Inventors:
김영신 KIM, Young Shin; KR
송준오 SONG, June O; KR
임창만 LIM, Chang Man; KR
김원중 KIM, Won Jung; KR
김기석 KIM, Ki Seok; KR
Agent:
허용록 HAW, Yong Noke; KR
Priority Data:
10-2017-011212401.09.2017KR
10-2017-011658812.09.2017KR
Title (EN) LIGHT EMITTING DEVICE PACKAGE AND LIGHT SOURCE DEVICE
(FR) BOÎTIER DE DISPOSITIF ÉLECTROLUMINESCENT ET DISPOSITIF DE SOURCE DE LUMIÈRE
(KO) 발광소자 패키지 및 광원 장치
Abstract:
(EN) A light emitting device package disclosed in an embodiment comprises first and second frames which are spaced apart from each other; a body which is disposed between the first and second frames; a light emitting device which includes first and second bonding portions at a lower portion thereof; and a first resin which is disposed between the body and the light emitting device, wherein the first frame may comprise a first protrusion portion which faces the first bonding portion of the light emitting device, the second frame may comprise a second protrusion portion which faces the second bonding portion of the light emitting device, and a first conductive layer may be included between the first frame and the first protrusion portion, and a second conductive layer may be included between the second frame and the second protrusion portion.
(FR) L'invention concerne un boîtier de dispositif électroluminescent décrit dans un mode de réalisation comprenant des premier et second cadres qui sont espacés l'un de l'autre ; un corps qui est disposé entre les premier et second cadres ; un dispositif électroluminescent qui comprend des première et seconde parties de liaison au niveau d'une partie inférieure de celui-ci ; et une première résine qui est disposée entre le corps et le dispositif électroluminescent, le premier cadre pouvant comprendre une première partie en saillie qui fait face à la première partie de liaison du dispositif électroluminescent, le second cadre pouvant comprendre une seconde partie en saillie qui fait face à la seconde partie de liaison du dispositif électroluminescent, et une première couche conductrice peut être comprise entre le premier cadre et la première partie en saillie, et une seconde couche conductrice peut être comprise entre le second cadre et la seconde partie en saillie.
(KO) 실시 예에 개시된 발광소자 패키지는 서로 이격되어 배치된 제1 및 제2 프레임; 상기 제1 및 제2 프레임 사이에 배치된 몸체; 하부에 제1 및 제2 본딩부를 포함하는 발광소자; 및 상기 몸체와 상기 발광소자 사이에 배치되는 제1수지;를 포함하고, 상기 제1프레임은 상기 발광소자의 제1본딩부에 대면되는 제1돌출부를 포함하며, 상기 제2프레임은 상기 발광소자의 제2본딩부에 대면하는 제2돌출부를 포함하며, 상기 제1프레임과 상기 제1돌출부 사이에 제1도전층 및 상기 제2프레임과 상기 제2돌출부 사이에 제2도전층을 포함할 수 있다.
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Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JO, JP, KE, KG, KH, KN, KP, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: Korean (KO)
Filing Language: Korean (KO)