Some content of this application is unavailable at the moment.
If this situation persist, please contact us atFeedback&Contact
1. (WO2019045462) METHOD FOR MANUFACTURING FLEXIBLE CIRCUIT BOARD AND FLEXIBLE CIRCUIT BOARD MANUFACTURED USING SAME
Latest bibliographic data on file with the International Bureau    Submit observation

Pub. No.: WO/2019/045462 International Application No.: PCT/KR2018/010022
Publication Date: 07.03.2019 International Filing Date: 30.08.2018
IPC:
H05K 1/02 (2006.01) ,H05K 3/28 (2006.01) ,H05K 1/03 (2006.01)
H ELECTRICITY
05
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
K
PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
1
Printed circuits
02
Details
H ELECTRICITY
05
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
K
PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
3
Apparatus or processes for manufacturing printed circuits
22
Secondary treatment of printed circuits
28
Applying non-metallic protective coatings
H ELECTRICITY
05
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
K
PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
1
Printed circuits
02
Details
03
Use of materials for the substrate
Applicants:
스템코 주식회사 STEMCO CO., LTD. [KR/KR]; 충청북도 청주시 흥덕구 옥산면 과학산업4로 79-44 79-44, Gwahaksaneop 4-ro, Oksan-myeon, Heungdeok-gu, Cheongju-si Chungcheongbuk-do 28122, KR
Inventors:
이재문 LEE, Jae Mun; KR
손동은 SON, Dong Eun; KR
임재준 LIM, Jae Joon; KR
임창균 YIM, Chang Kyun; KR
이종래 LEE, Jong Rae; KR
Agent:
특허법인 가산 KASAN IP & LAW FIRM; 서울시 서초구 남부순환로 2423, 한원빌딩 7층 7th Floor, HanwonBuilding, 2423 Nambusunhwan-ro Seocho-gu Seoul 06719, KR
Priority Data:
10-2017-011161701.09.2017KR
Title (EN) METHOD FOR MANUFACTURING FLEXIBLE CIRCUIT BOARD AND FLEXIBLE CIRCUIT BOARD MANUFACTURED USING SAME
(FR) PROCÉDÉ DE FABRICATION DE CARTE À CIRCUITS IMPRIMÉS FLEXIBLE ET CARTE À CIRCUITS IMPRIMÉS FLEXIBLE FABRIQUÉE AU MOYEN DUDIT PROCÉDÉ
(KO) 연성 회로 기판의 제조 방법 및 이를 이용하여 제조된 연성 회로 기판
Abstract:
(EN) Provided are a method for manufacturing a flexible circuit board and a flexible circuit board manufactured using the same. The method for manufacturing a flexible circuit board includes: providing a base film; forming a first wiring pattern on one surface of the base film; forming a first protection layer having high transmittance so as to cover the first wiring pattern; performing an optical inspection on the first wiring pattern on which the first protection layer having high transmittance is formed; and forming a second protection layer having low transmittance on the first protection layer having high transmittance.
(FR) La présente invention concerne un procédé de fabrication d'une carte à circuits imprimés flexible et une carte à circuits imprimés flexible fabriquée au moyen dudit procédé. Le procédé de fabrication d'une carte à circuits imprimés flexible consiste à : utiliser un film de base ; former un premier motif de câblage sur une surface du film de base ; former une première couche de protection ayant une transmittance élevée de façon à recouvrir le premier motif de câblage ; effectuer une inspection optique du premier motif de câblage sur lequel est formée la première couche de protection ayant une transmittance élevée ; et former une seconde couche de protection ayant une faible transmittance sur la première couche de protection ayant une transmittance élevée.
(KO) 연성 회로 기판의 제조 방법 및 이를 통해 제조된 연성 회로 기판이 제공된다. 상기 연성 회로 기판의 제조 방법은, 베이스 필름을 제공하고, 상기 베이스 필름의 일면 상에 제1 배선 패턴을 형성하고, 상기 제1 배선 패턴을 덮도록 고투과성 제1 보호층을 형성하고, 상기 고투과성 제1 보호층이 형성된 상기 제1 배선 패턴에 대하여 광학 검사를 수행하고, 상기 고투과성 제1 보호층 상에 저투과성 제2 보호층을 형성하는 것을 포함한다.
front page image
Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JO, JP, KE, KG, KH, KN, KP, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: Korean (KO)
Filing Language: Korean (KO)