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1. (WO2019045374) ELECTROLYTIC COPPER FOIL, METHOD FOR PRODUCING SAME, AND HIGH-CAPACITY LI SECONDARY BATTERY NEGATIVE ELECTRODE INCLUDING SAME
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Pub. No.: WO/2019/045374 International Application No.: PCT/KR2018/009801
Publication Date: 07.03.2019 International Filing Date: 24.08.2018
IPC:
H01M 4/66 (2006.01) ,H01M 4/13 (2010.01) ,H01M 10/052 (2010.01) ,C25D 1/04 (2006.01) ,C25D 3/38 (2006.01) ,C25D 5/48 (2006.01)
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
M
PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
4
Electrodes
02
Electrodes composed of, or comprising, active material
64
Carriers or collectors
66
Selection of materials
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
M
PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
4
Electrodes
02
Electrodes composed of, or comprising, active material
13
Electrodes for accumulators with non-aqueous electrolyte, e.g. for lithium-accumulators; Processes of manufacture thereof
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
M
PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
10
Secondary cells; Manufacture thereof
05
Accumulators with non-aqueous electrolyte
052
Li-accumulators
C CHEMISTRY; METALLURGY
25
ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
D
PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; JOINING WORKPIECES BY ELECTROLYSIS; APPARATUS THEREFOR
1
Electroforming
04
Wires; Strips; Foils
C CHEMISTRY; METALLURGY
25
ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
D
PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; JOINING WORKPIECES BY ELECTROLYSIS; APPARATUS THEREFOR
3
Electroplating; Baths therefor
02
from solutions
38
of copper
C CHEMISTRY; METALLURGY
25
ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
D
PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; JOINING WORKPIECES BY ELECTROLYSIS; APPARATUS THEREFOR
5
Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
48
After-treatment of electroplated surfaces
Applicants:
케이씨에프테크놀로지스 주식회사 KCF TECHNOLOGIES CO., LTD. [KR/KR]; 경기도 안양시 동안구 엘에스로 116번길 39 39, LS-ro 116beon-gil, Dongan-gu, Anyang-si, Gyeonggi-do 14118, KR
Inventors:
김승민 KIM, Seung Min; KR
김호건 KIM, Ho Gun; KR
Agent:
특허법인 천문 ASTRAN INT'L IP GROUP; 서울시 강남구 역삼로 233, 5층 (역삼동, 신성빌딩) (ShinSung Building, Yeoksam-dong) 5th Floor, 233, Yeoksam-ro, Gangnam-gu, Seoul 06225, KR
Priority Data:
10-2017-011173501.09.2017KR
Title (EN) ELECTROLYTIC COPPER FOIL, METHOD FOR PRODUCING SAME, AND HIGH-CAPACITY LI SECONDARY BATTERY NEGATIVE ELECTRODE INCLUDING SAME
(FR) FEUILLE DE CUIVRE ÉLECTROLYTIQUE, PROCÉDÉ DE PRODUCTION DE CELLE-CI, ET ÉLECTRODE NÉGATIVE DE BATTERIE SECONDAIRE AU LI À CAPACITÉ ÉLEVÉE COMPRENANT CELLE-CI
(KO) 전해동박, 그 제조방법 및 이를 포함하는 고용량 Li 이차전지용 음극
Abstract:
(EN) The present invention relates to an electrolytic copper foil current collector in which the surface properties of the electrolytic copper foil surface are controlled to achieve a high adhesiveness to a negative electrode material. The present invention provides an electrolytic copper foil having a first surface and the second surface, the electrolytic copper foil being characterized by comprising a first protective layer on the first surface side, a second protective layer on the second surface side, and a copper film between the first and second protective layers, wherein the coupling coefficient at the first surface or second surface of the electrolytic copper foil is 1.5 to 9.4 as represented by coupling coefficient = Rp/µm + peak density/30 + amount of Cr adhesion/(mg/m2) (here, peak density is measured according to ASME standard B46.1). According to the present invention, an electrolytic copper foil having a high adhesiveness to a negative electrode material and a low electrical resistance can be provided by controlling the surface properties of the electrolytic copper foil surface.
(FR) La présente invention concerne un collecteur de courant à feuille de cuivre électrolytique dans lequel les propriétés de surface de la surface de feuille de cuivre électrolytique sont contrôlées pour obtenir une adhésivité élevée à un matériau d'électrode négative. La présente invention concerne une feuille de cuivre électrolytique ayant une première surface et la seconde surface, la feuille de cuivre électrolytique étant caractérisée en ce qu'elle comprend une première couche de protection sur le côté de première surface, une seconde couche de protection sur le côté de seconde surface, et un film de cuivre entre les première et seconde couches de protection, le coefficient de couplage au niveau de la première surface ou de la seconde surface de la feuille de cuivre électrolytique étant de 1,5 à 9,4 comme représenté par le coefficient de couplage = Rp/µm + densité de pic/30 + quantité d'adhérence de Cr/(mg/m2) (ici, la densité de pic est mesurée selon la norme ASME B46.1). Selon la présente invention, une feuille de cuivre électrolytique ayant une adhésivité élevée à un matériau d'électrode négative et une faible résistance électrique peut être fournie en contrôlant les propriétés de surface de la surface de feuille de cuivre électrolytique.
(KO) 본 발명은 동박 표면의 표면 특성을 제어하여 음극재와 높은 밀착력을 갖는 전해동박 집전체에 관한 것이다. 본 발명은 제1 표면 및 상기 제2 표면을 갖는 전해동박에 있어서, 상기 제1 표면 측의 제1 보호층; 상기 제2 표면 측의 제2 보호층; 및 상기 제1 및 제2 보호층 사이의 구리막을 포함하고, 상기 전해동박의 상기 제1 표면 또는 제2 표면에서 결합계수 = Rp/㎛ + 피크 밀도/30 + Cr 부착량/(mg/m2) (여기서, 피크 밀도는 ASME B46.1 규격에 따라 측정된 값임)로 표현되는 결합계수가 1.5 내지 9.4인 것을 특징으로 하는 전해동박을 제공한다. 본 발명에 따르면, 동박 표면의 표면 특성을 제어하여 음극재와 높은 밀착력을 갖고 낮은 전기적 저항을 갖는 전해동박을 제공할 수 있게 된다.
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Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JO, JP, KE, KG, KH, KN, KP, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: Korean (KO)
Filing Language: Korean (KO)