Some content of this application is unavailable at the moment.
If this situation persist, please contact us atFeedback&Contact
1. (WO2019045340) SUBSTRATE PLACING MEANS AND SUBSTRATE TREATING DEVICE
Latest bibliographic data on file with the International Bureau    Submit observation

Pub. No.: WO/2019/045340 International Application No.: PCT/KR2018/009507
Publication Date: 07.03.2019 International Filing Date: 20.08.2018
IPC:
H01L 21/687 (2006.01) ,H01L 21/67 (2006.01) ,H01L 21/683 (2006.01)
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21
Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
67
Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components
683
for supporting or gripping
687
using mechanical means, e.g. chucks, clamps or pinches
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21
Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
67
Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21
Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
67
Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components
683
for supporting or gripping
Applicants:
주성엔지니어링(주) JUSUNG ENGINEERING CO., LTD. [KR/KR]; 경기도 광주시 오포읍 오포로 240 240, Opo-ro, Opo-eup Gwangju-si Gyeonggi-do 12773, KR
Inventors:
김종식 KIM, Jong Sik; KR
신현욱 SHIN, Hyun Wook; KR
이수연 LEE, Su Yeon; KR
Agent:
특허법인 천문 ASTRAN INT'L IP GROUP; 서울시 강남구 역삼로 233, 5층 (역삼동, 신성빌딩) (ShinSung Building, Yeoksam-dong) 5th Floor, 233, Yeoksam-ro, Gangnam-gu Seoul 06225, KR
Priority Data:
10-2017-011038030.08.2017KR
10-2018-005266508.05.2018KR
Title (EN) SUBSTRATE PLACING MEANS AND SUBSTRATE TREATING DEVICE
(FR) MOYEN DE PLACEMENT DE SUBSTRAT ET DISPOSITIF DE TRAITEMENT DE SUBSTRAT
(KO) 기판안치수단 및 기판처리장치
Abstract:
(EN) The present invention relates to a substrate placing means and a substrate treating device, the substrate placing means comprising: a disk; and a plurality of substrate placing units radially disposed around the center of the disk, and having substrates respectively placed therein, wherein upper surfaces of the substrate placing units protrude further upwardly than an upper surface of the disk.
(FR) La présente invention concerne un moyen de placement de substrat et un dispositif de traitement de substrat, le moyen de placement de substrat comprenant : un disque ; et une pluralité d'unités de placement de substrat disposées radialement autour du centre du disque, et ayant des substrats respectivement placés à l'intérieur, les surfaces supérieures des unités de placement de substrat faisant saillie davantage vers le haut qu'une surface supérieure du disque.
(KO) 본 발명은 기판처리장치의 기판안치수단으로서, 디스크; 및 상기 디스크의 중심에서 방사상으로 배치되며, 기판이 각각 안치되는 복수개의 기판안치부를 포함하되, 상기 기판안치부의 상면은 상기 디스크의 상면보다 상측으로 더 돌출된 기판안치수단 및 기판처리장치에 관한 것이다.
front page image
Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JO, JP, KE, KG, KH, KN, KP, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: Korean (KO)
Filing Language: Korean (KO)