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1. (WO2019045208) RECONFIGURABLE PHOTOCONDUCTIVE ELECTRICAL WIRING CHIP
Latest bibliographic data on file with the International Bureau    Submit observation

Pub. No.: WO/2019/045208 International Application No.: PCT/KR2018/003150
Publication Date: 07.03.2019 International Filing Date: 19.03.2018
IPC:
H01L 31/02 (2006.01) ,H01L 31/0376 (2006.01) ,H01L 31/16 (2006.01) ,H01L 31/0224 (2006.01)
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
31
Semiconductor devices sensitive to infra-red radiation, light, electromagnetic radiation of shorter wavelength, or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
02
Details
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
31
Semiconductor devices sensitive to infra-red radiation, light, electromagnetic radiation of shorter wavelength, or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
0248
characterised by their semiconductor bodies
036
characterised by their crystalline structure or particular orientation of the crystalline planes
0376
including amorphous semiconductors
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
31
Semiconductor devices sensitive to infra-red radiation, light, electromagnetic radiation of shorter wavelength, or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
12
structurally associated with, e.g. formed in or on a common substrate with, one or more electric light sources, e.g. electroluminescent light sources, and electrically or optically coupled thereto
16
the semiconductor device sensitive to radiation being controlled by the light source or sources
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
31
Semiconductor devices sensitive to infra-red radiation, light, electromagnetic radiation of shorter wavelength, or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
02
Details
0224
Electrodes
Applicants:
고려대학교 산학협력단 KOREA UNIVERSITY RESEARCH AND BUSINESS FOUNDATION [KR/KR]; 서울시 성북구 안암로 145 145, Anam-ro Seongbuk-gu Seoul 02841, KR
Inventors:
천홍구 CHUN, Honggu; KR
Agent:
특허법인 누리 NURY PATENT LAW FIRM; 서울시 강남구 테헤란로 25길 15-5, 4층 4F, 15-5, Teheran-ro 25-gil Gangnam-gu Seoul 06131, KR
Priority Data:
10-2017-011044130.08.2017KR
Title (EN) RECONFIGURABLE PHOTOCONDUCTIVE ELECTRICAL WIRING CHIP
(FR) PUCE DE CÂBLAGE ÉLECTRIQUE PHOTOCONDUCTRICE RECONFIGURABLE
(KO) 재구성 가능한 광도전 전기 배선 칩
Abstract:
(EN) A reconfigurable photoconductive electrical wiring chip, according to one embodiment of the present invention, comprises: a plurality of conductive patterns arranged on a substrate so as to be spaced apart from each other; a first photoconductive layer arranged between the conductive patterns; and a second photoconductive layer arranged on the conductive patterns. The first photoconductive layer electrically connects the conductive patterns by means of light irradiation of a first illumination pattern, and the second photoconductive layer operates as a photoconductive electrode which electrically connects the conductive patterns or the first photoconductive layer in a direction perpendicular to the substrate by means of light irradiation of a second illumination pattern, so as to provide an electric wiring to an object arranged on the second photoconductive layer.
(FR) La présente invention concerne une puce de câblage électrique photoconductrice reconfigurable, selon un mode de réalisation de la présente invention, qui consiste : en une pluralité de motifs conducteurs disposés sur un substrat de manière à être espacés les uns des autres; en une première couche photoconductrice disposée entre les motifs conducteurs; et en une seconde couche photoconductrice disposée sur les motifs conducteurs. La première couche photoconductrice connecte électriquement les motifs conducteurs au moyen d'une irradiation lumineuse d'un premier motif d'illumination et la seconde couche photoconductrice fonctionne comme une électrode photoconductrice qui connecte électriquement les motifs conducteurs ou la première couche photoconductrice dans une direction perpendiculaire au substrat au moyen d'une irradiation lumineuse d'un second motif d'illumination de manière à fournir un câblage électrique à un objet disposé sur la seconde couche photoconductrice.
(KO) 본 발명의 일 실시예에 따른 재구성 가능한 광도전 전기 배선 칩은, 기판 상에 서로 이격되어 배치된 복수의 도전 패턴들; 상기 도전 패턴들 사이에 배치된 제1 광도전층; 및 상기 도전 패턴들 상에 배치된 제2 광도전층을 포함한다. 상기 제1 광도전층은 제1 조명 패턴의 광 조사에 의하여 상기 도전 패턴들을 전기적으로 연결하고, 상기 제2 광도전층은 제2 조명 패턴의 광 조사에 의하여 상기 도전 패턴들 또는 상기 제1 광도전층을 상기 기판에 수직한 방향으로 전기적으로 연결하는 광도전 전극으로 동작하여 제2 광도전층 상에 배치된 대상물에 전기 배선을 제공한다.
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Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JO, JP, KE, KG, KH, KN, KP, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: Korean (KO)
Filing Language: Korean (KO)