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1. (WO2019045204) BOAT DEVICE
Latest bibliographic data on file with the International BureauSubmit observation

Pub. No.: WO/2019/045204 International Application No.: PCT/KR2018/001323
Publication Date: 07.03.2019 International Filing Date: 31.01.2018
IPC:
H01L 21/673 (2006.01) ,H01L 31/18 (2006.01)
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21
Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
67
Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components
673
using specially adapted carriers
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
31
Semiconductor devices sensitive to infra-red radiation, light, electromagnetic radiation of shorter wavelength, or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
18
Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
Applicants:
HANWHA CORPORATION [KR/KR]; 86, Cheonggyecheon-ro Jung-gu Seoul 04541, KR
Inventors:
LEE, Hyun Ho; KR
KIM, Young Gi; KR
PARK, Sang Tae; KR
Agent:
TW INTERNATIONAL PATENT AND LAWFIRM; 13F 114, Yeoksam-ro Gangnam-gu Seoul 06252, KR
Priority Data:
10-2017-011203901.09.2017KR
Title (EN) BOAT DEVICE
(FR) HYDROGLISSEUR
Abstract:
(EN) The present invention discloses a boat device, comprising: a plate portion including mutually adjacent first and second plates, where a wafer is attached and detached in an empty gap between each plate; and a pin provided at each plate to support an outside of the wafer; wherein the pin is provided with at least three pins including a first pin, a second pin and a third pin relative to one wafer.
(FR) La présente invention concerne un hydroglisseur, comprenant : une partie plaque comprenant des première et seconde plaques mutuellement adjacentes, une tranche étant fixée et détachée dans un espace vide entre chaque plaque ; et une broche disposée au niveau de chaque plaque pour supporter un extérieur de la tranche ; la broche comprenant au moins trois broches comprenant une première broche, une seconde broche et une troisième broche par rapport à une tranche.
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Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JO, JP, KE, KG, KH, KN, KP, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: English (EN)
Filing Language: English (EN)