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1. (WO2019045167) LIGHT EMITTING DEVICE PACKAGE AND LIGHT SOURCE DEVICE HAVING SAME
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Pub. No.: WO/2019/045167 International Application No.: PCT/KR2017/011087
Publication Date: 07.03.2019 International Filing Date: 29.09.2017
IPC:
H01L 33/48 (2010.01) ,H01L 33/62 (2010.01) ,H01L 33/52 (2010.01)
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
33
Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
48
characterised by the semiconductor body packages
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
33
Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
48
characterised by the semiconductor body packages
62
Arrangements for conducting electric current to or from the semiconductor body, e.g. leadframe, wire-bond or solder balls
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
33
Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
48
characterised by the semiconductor body packages
52
Encapsulations
Applicants:
엘지이노텍 주식회사 LG INNOTEK CO., LTD. [KR/KR]; 서울시 중구 후암로 98 98, Huam-ro Jung-gu Seoul 04637, KR
Inventors:
김원중 KIM, Won Jung; KR
송준오 SONG, June O; KR
김기석 KIM, Ki Seok; KR
임창만 LIM, Chang Man; KR
Agent:
김기문 KIM, Ki Moon; KR
Priority Data:
10-2017-011212201.09.2017KR
Title (EN) LIGHT EMITTING DEVICE PACKAGE AND LIGHT SOURCE DEVICE HAVING SAME
(FR) BOÎTIER DE DISPOSITIF ÉLECTROLUMINESCENT ET DISPOSITIF DE SOURCE LUMINEUSE LE COMPRENANT
(KO) 발광소자 패키지 및 이를 구비한 광원 장치
Abstract:
(EN) A light emitting device package disclosed in an embodiment may comprise: first to fourth frames spaced apart from each other; conductive layers disposed in first to fourth through holes passing through the top and bottom surfaces of the first to fourth frames, respectively; a body supporting the first to fourth frames; a first light emitting device which includes a first bonding portion electrically connected to the first frame and a second bonding portion electrically connected to the second frame; and a second light emitting device which includes a third bonding portion electrically connected to the third frame and a fourth bonding portion electrically connected to the fourth frame. Each of the first to fourth through holes may overlap with the first to fourth bonding portions in a vertical direction, and the first to fourth bonding portions may contact the conductive layers.
(FR) Un boîtier de dispositif électroluminescent décrit dans un mode de réalisation de la présente invention peut comprendre : des premier à quatrième cadres espacés les uns des autres ; des couches conductrices disposées dans des premier à quatrième trous traversants passant à travers les surfaces supérieure et inférieure des première à quatrième cadres, respectivement ; un corps supportant les première à quatrième cadres ; un premier dispositif électroluminescent qui comprend une première partie de liaison connectée électriquement au premier cadre et une seconde partie de liaison connectée électriquement au second cadre ; et un second dispositif électroluminescent qui comprend une troisième partie de liaison connectée électriquement au troisième cadre et une quatrième partie de liaison connectée électriquement au quatrième cadre. Chacun des premier à quatrième trous traversants peut chevaucher les première à quatrième parties de liaison dans une direction verticale, et les première à quatrième parties de liaison peuvent entrer en contact avec les couches conductrices.
(KO) 실시 예에 개시된 발광소자 패키지는, 서로 이격되어 배치되는 제1 내지 제4 프레임; 상기 제1 내지 제4 프레임 각각의 상면과 하면을 관통하는 제1 내지 제4 관통홀에 배치되는 도전층; 상기 제1 내지 제4 프레임을 지지하는 몸체; 상기 제1 프레임과 전기적으로 연결되는 제1 본딩부, 및 상기 제2 프레임과 전기적으로 연결되는 제2 본딩부를 포함하는 제1 발광소자; 및 상기 제3 프레임과 전기적으로 연결되는 제3 본딩부, 및 상기 제4 프레임과 전기적으로 연결되는 제4 본딩부를 포함하는 제2 발광소자;를 포함할 수 있다. 상기 제1 내지 제4 관통홀 각각은 상기 제1 내지 제4 본딩부와 수직방향으로 서로 중첩되고, 상기 제1 내지 제4 본딩부는 상기 도전층과 접촉될 수 있다.
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Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JO, JP, KE, KG, KH, KN, KP, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: Korean (KO)
Filing Language: Korean (KO)