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1. (WO2019045166) LIGHT-EMITTING DEVICE PACKAGE
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Pub. No.: WO/2019/045166 International Application No.: PCT/KR2017/011084
Publication Date: 07.03.2019 International Filing Date: 29.09.2017
IPC:
H01L 33/48 (2010.01) ,H01L 33/52 (2010.01) ,H01L 33/62 (2010.01)
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
33
Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
48
characterised by the semiconductor body packages
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
33
Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
48
characterised by the semiconductor body packages
52
Encapsulations
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
33
Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
48
characterised by the semiconductor body packages
62
Arrangements for conducting electric current to or from the semiconductor body, e.g. leadframe, wire-bond or solder balls
Applicants:
엘지이노텍 주식회사 LG INNOTEK CO., LTD. [KR/KR]; 서울시 중구 후암로 98 98, Huam-ro Jung-gu Seoul 04637, KR
Inventors:
임창만 LIM, Chang Man; KR
김기석 KIM, Ki Seok; KR
김원중 KIM, Won Jung; KR
송준오 SONG, June O; KR
Agent:
김기문 KIM, Ki Moon; KR
Priority Data:
10-2017-011184601.09.2017KR
Title (EN) LIGHT-EMITTING DEVICE PACKAGE
(FR) BOÎTIER DE DISPOSITIF ÉLECTROLUMINESCENT
(KO) 발광소자 패키지
Abstract:
(EN) A light-emitting device package according to an embodiment comprises: a first frame including a first opening penetrating the upper surface and the lower surface thereof, and a second frame spaced apart from the first frame and including a second opening; first and second conductive layers respectively disposed in the first and second openings; a body disposed between the first and second frames; a first resin disposed on the body; and a light-emitting device disposed on an adhesive. A light-emitting device according to an embodiment includes a first bonding portion electrically connected to the first frame and a second bonding portion spaced apart from the first bonding portion and electrically connected to the second frame, wherein the first and second bonding portions are respectively disposed on the first and second openings, and a first alloy layer made of an alloy of the first conductive layer and the first frame can be disposed between the first conductive layer and the first frame.
(FR) Un boîtier de dispositif électroluminescent selon un mode de réalisation de la présente invention comprend : un premier cadre comprenant une première ouverture pénétrant la surface supérieure et la surface inférieure de celui-ci, et un deuxième cadre espacé du premier cadre et comprenant une deuxième ouverture ; des première et deuxième couches conductrices respectivement disposées dans les première et deuxième ouvertures ; un corps disposé entre les premier et deuxième cadres ; une première résine disposée sur le corps ; et un dispositif électroluminescent disposé sur un adhésif. Un dispositif électroluminescent selon un mode de réalisation comprend une première partie de liaison électriquement connectée au premier cadre et une deuxième partie de liaison espacée de la première partie de liaison et électriquement connectée au deuxième cadre, les première et deuxième parties de liaison étant respectivement disposées sur les première et deuxième ouvertures, et une première couche d’alliage constituée d’un alliage de la première couche conductrice et du premier cadre pouvant être disposée entre la première couche conductrice et le premier cadre.
(KO) 실시 예에 따른 발광소자 패키지는, 상면과 하면을 관통하는 제1 개구부를 포함하는 제1 프레임 및 제1 프레임과 이격되고 제2 개구부를 포함하는 제2 프레임; 제1 및 제2 개구부 내에 각각 배치되는 제1 및 제2 도전층; 제1 및 제2 프레임 사이에 배치된 몸체; 몸체 상에 배치되는 제1 수지; 및 접착제 상에 배치되는 발광소자; 를 포함할 수 있다. 실시 예에 따른 발광소자는 제1 프레임과 전기적으로 연결되는 제1 본딩부 및 제1 본딩부와 이격되어 제2 프레임과 전기적으로 연결되는 제2 본딩부를 포함하고, 제1 및 제2 본딩부는 제1 및 제2 개구부 상에 각각 배치되고, 제1 도전층과 제1 프레임 사이에는 제1 도전층 및 제1 프레임의 합금으로 이루어진 제1 합금층이 배치될 수 있다.
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Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JO, JP, KE, KG, KH, KN, KP, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: Korean (KO)
Filing Language: Korean (KO)