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1. (WO2019045139) PATTERN COIL ASSEMBLY AND SUBSTRATE MOLDING STRUCTURE FOR RELEASING FROM INJECTION MOLD COMPRISING SAME
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Pub. No.: WO/2019/045139 International Application No.: PCT/KR2017/009516
Publication Date: 07.03.2019 International Filing Date: 31.08.2017
IPC:
H01F 27/30 (2006.01) ,H01F 27/29 (2006.01) ,H01F 41/04 (2006.01)
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
F
MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
27
Details of transformers or inductances, in general
28
Coils; Windings; Conductive connections
30
Fastening or clamping coils, windings, or parts thereof together; Fastening or mounting coils or windings on core, casing, or other support
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
F
MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
27
Details of transformers or inductances, in general
28
Coils; Windings; Conductive connections
29
Terminals; Tapping arrangements
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
F
MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
41
Apparatus or processes specially adapted for manufacturing or assembling the devices covered by this subclass
02
for manufacturing cores, coils or magnets
04
for manufacturing coils
Applicants:
한동렬 HAN, Dong Ryoul [KR/KR]; KR
Inventors:
한동렬 HAN, Dong Ryoul; KR
Agent:
임상엽 LIM, Sang Yeob; KR
Priority Data:
10-2017-011000430.08.2017KR
Title (EN) PATTERN COIL ASSEMBLY AND SUBSTRATE MOLDING STRUCTURE FOR RELEASING FROM INJECTION MOLD COMPRISING SAME
(FR) ENSEMBLE DE BOBINE À MOTIF ET STRUCTURE DE MOULAGE DE SUBSTRAT POUR LIBÉRATION DEPUIS UN MOULE D’INJECTION COMPRENANT CELUI-CI
(KO) 패턴 코일 어셈블리 및 이를 포함하는 이형사출용 기판몰딩구조물
Abstract:
(EN) A pattern coil substrate assembly according to an embodiment of the present invention includes a first substrate which has one surface on which a coil pattern is formed and the other surface on which any one of the coil pattern and a connection pattern is formed; and a second substrate on which the connection pattern is formed on at least one of one surface and the other surface thereof, on which any one of the connection pattern and the coil pattern is formed on the other of the one surface and the other surface, and which is electrically connected in series or in parallel with the first substrate.
(FR) Un ensemble de substrat de bobine de motif selon un mode de réalisation de la présente invention comprend un premier substrat qui comporte une surface sur laquelle un motif de bobine est formé et l’autre surface sur laquelle l’un quelconque du motif de bobine et d'un motif de connexion est formé ; et un deuxième substrat sur lequel le motif de connexion est formé sur au moins l’une parmi une surface et l’autre surface de celui-ci, sur lequel l’un quelconque du motif de connexion et du motif de bobine est formé sur l’autre parmi la première surface et l’autre surface, et qui est électriquement connecté en série ou en parallèle au premier substrat.
(KO) 본 발명의 실시예에 따른 패턴코일 기판어셈블리는 일면에 코일패턴이 형성되고, 타면에 상기 코일패턴 및 연결패턴 중 어느 하나가 형성되는 제1기판 및 일면 및 타면 중 적어도 어느 하나에 상기 연결패턴이 형성되고, 다른 하나에는 상기 연결패턴 및 상기 코일패턴 중 어느 하나가 형성되며, 상기 제1기판과 전기적으로 직렬 또는 병렬로 연결되는 제2기판을 포함한다.
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Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JO, JP, KE, KG, KH, KN, KP, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: Korean (KO)
Filing Language: Korean (KO)