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1. (WO2019045108) ELASTIC CIRCUIT BOARD AND PATCH DEVICE IN WHICH SAME IS USED
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Pub. No.: WO/2019/045108 International Application No.: PCT/JP2018/032672
Publication Date: 07.03.2019 International Filing Date: 03.09.2018
IPC:
H05K 1/02 (2006.01)
H ELECTRICITY
05
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
K
PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
1
Printed circuits
02
Details
Applicants:
パナソニックIPマネジメント株式会社 PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD. [JP/JP]; 大阪府大阪市中央区城見2丁目1番61号 1-61, Shiromi 2-chome, Chuo-ku, Osaka-shi, Osaka 5406207, JP
Inventors:
阿部 孝寿 ABE, Takatoshi; --
澤田 知昭 SAWADA, Tomoaki; --
深尾 朋寛 FUKAO, Tomohiro; --
Agent:
小谷 悦司 KOTANI, Etsuji; JP
小谷 昌崇 KOTANI, Masataka; JP
宇佐美 綾 USAMI, Aya; JP
Priority Data:
62/553,96704.09.2017US
Title (EN) ELASTIC CIRCUIT BOARD AND PATCH DEVICE IN WHICH SAME IS USED
(FR) CARTE DE CIRCUIT IMPRIMÉ ÉLASTIQUE ET DISPOSITIF PLANAIRE DANS LEQUEL ELLE EST UTILISÉE
(JA) 伸縮性回路基板、及び、それを用いたパッチデバイス
Abstract:
(EN) The present invention pertains to a circuit board used in a member for electronics. Specifically, the present invention pertains to an elastic circuit board characterized by having an elastic base material, elastic wiring, and a land part in contact with the elastic base material.
(FR) La présente invention concerne une carte de circuit imprimé utilisée dans un élément pour l'électronique. En particulier, l'invention concerne une carte de circuit imprimé élastique caractérisée en ce qu'elle comprend un matériau de base élastique, un câblage élastique et une partie d'appui en contact avec le matériau de base élastique.
(JA) 本発明は、エレクトロニクス用部材に用いられる回路基板に関する。具体的には、伸縮性基材、伸縮性配線及び前記伸縮性基材と接しているランド部を有することを特徴とする伸縮性回路基板に関する。
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Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JO, JP, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)