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1. (WO2019045030) ELECTROCONDUCTIVE RESIN COMPOSITION
Latest bibliographic data on file with the International Bureau    Submit observation

Pub. No.: WO/2019/045030 International Application No.: PCT/JP2018/032286
Publication Date: 07.03.2019 International Filing Date: 31.08.2018
IPC:
C08L 101/00 (2006.01) ,B32B 7/02 (2006.01) ,B32B 27/18 (2006.01) ,B65D 85/86 (2006.01) ,C08K 3/04 (2006.01) ,C08L 23/04 (2006.01) ,C08L 25/06 (2006.01) ,C08L 51/06 (2006.01) ,C08L 55/02 (2006.01) ,H01B 1/24 (2006.01) ,H01B 5/14 (2006.01)
C CHEMISTRY; METALLURGY
08
ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
L
COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
101
Compositions of unspecified macromolecular compounds
B PERFORMING OPERATIONS; TRANSPORTING
32
LAYERED PRODUCTS
B
LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
7
Layered products characterised by the relation between layers, i.e. products essentially comprising layers having different physical properties or products characterised by the interconnection of layers
02
in respect of physical properties, e.g. hardness
B PERFORMING OPERATIONS; TRANSPORTING
32
LAYERED PRODUCTS
B
LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
27
Layered products essentially comprising synthetic resin
18
characterised by the use of special additives
B PERFORMING OPERATIONS; TRANSPORTING
65
CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
D
CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
85
Containers, packaging elements or packages, specially adapted for particular articles or materials
86
for electrical components
C CHEMISTRY; METALLURGY
08
ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
K
USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES AS COMPOUNDING INGREDIENTS
3
Use of inorganic ingredients
02
Elements
04
Carbon
C CHEMISTRY; METALLURGY
08
ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
L
COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
23
Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers
02
not modified by chemical after-treatment
04
Homopolymers or copolymers of ethene
C CHEMISTRY; METALLURGY
08
ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
L
COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
25
Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by an aromatic carbocyclic ring; Compositions of derivatives of such polymers
02
Homopolymers or copolymers of hydrocarbons
04
Homopolymers or copolymers of styrene
06
Polystyrene
C CHEMISTRY; METALLURGY
08
ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
L
COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
51
Compositions of graft polymers in which the grafted component is obtained by reactions only involving carbon-to-carbon unsaturated bonds; Compositions of derivatives of such polymers
06
grafted on to homopolymers or copolymers of aliphatic hydrocarbons containing only one carbon-to-carbon double bond
C CHEMISTRY; METALLURGY
08
ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
L
COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
55
Compositions of homopolymers or copolymers, obtained by polymerisation reactions only involving carbon-to-carbon unsaturated bonds, not provided for in groups C08L23/-C08L53/211
02
ABS [Acrylonitrile-Butadiene-Styrene] polymers
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
B
CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
1
Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
20
Conductive material dispersed in non-conductive organic material
24
the conductive material comprising carbon-silicon compounds, carbon, or silicon
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
B
CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
5
Non-insulated conductors or conductive bodies characterised by their form
14
comprising conductive layers or films on insulating-supports
Applicants:
デンカ株式会社 DENKA COMPANY LIMITED [JP/JP]; 東京都中央区日本橋室町二丁目1番1号 1-1, Nihonbashi-Muromachi 2-chome, Chuo-ku, Tokyo 1038338, JP
Inventors:
長谷川 勝 HASEGAWA Masaru; JP
熊谷 雄志 KUMAGAI Yushi; JP
荒井 亨 ARAI Toru; JP
Agent:
園田・小林特許業務法人 SONODA & KOBAYASHI INTELLECTUAL PROPERTY LAW; 東京都新宿区西新宿二丁目1番1号 新宿三井ビル34階 34th Floor, Shinjuku Mitsui Building, 1-1, Nishi-Shinjuku 2-chome, Shinjuku-ku, Tokyo 1630434, JP
Priority Data:
2017-16843601.09.2017JP
Title (EN) ELECTROCONDUCTIVE RESIN COMPOSITION
(FR) COMPOSITION DE RÉSINE CONDUCTRICE
(JA) 導電性樹脂組成物
Abstract:
(EN) [Problem] The purpose of the present invention is to provide an electroconductive sheet in which contamination of an IC or the like caused by the shedding of carbon black or the like due to wear caused by contact with the IC or the like is dramatically reduced, as well as an electronic component packaging container or electronic component package obtained by molding said sheet. [Solution] An electroconductive resin composition containing 5–60 parts by mass carbon black and 10–100 parts by mass cross-copolymer per 100 parts by mass thermoplastic resin, and having a surface specific resistance of 102–1010Ω, as well as an electronic component packaging container or electronic component package using the same.
(FR) L'invention a pour objet de fournir une feuille conductrice dans laquelle la contamination d'un circuit intégré, ou similaire, causée par élimination d'un noir de carbone, ou similaire, sous l'effet de l'usure, lors d'un contact avec un circuit intégré, ou similaire, est considérablement réduite, et de fournir un réceptacle d'emballage de composant électronique et un corps d'emballage de composant électronique constitués par moulage de cette feuille. Plus précisément, l'invention concerne une composition de résine conductrice qui comprend 5 à 60 parties en masse d'un noir de carbone, et 10 à 100 parties en masse d'un copolymère réticulé, et qui présente une valeur ohmique de surface comprise entre 10 et 1010Ω, et un réceptacle d'emballage de composant électronique ainsi qu'un corps d'emballage de composant électronique mettant en œuvre cette composition.
(JA) 【課題】 IC等との接触時の摩耗によるカーボンブラック等の脱離が原因となるIC等の汚染を著しく減少させた導電性シート及び該シートを成形してなる電子部品包装容器や電子部品包装体を提供することを目的とするものである。 【解決手段】 熱可塑性樹脂100質量部に対し、カーボンブラック5~60質量部、クロス共重合体10~100質量部を含有し、その表面固有抵抗値が10~1010Ωである導電性樹脂組成物、およびこれを用いた電子部品包装容器や電子部品包装体である。
Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JO, JP, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)