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1. (WO2019044918) POLYMER FILM FORMING DEVICE, POLYMER FILM FORMING METHOD, AND SEPARATOR MANUFACTURING METHOD
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Pub. No.: WO/2019/044918 International Application No.: PCT/JP2018/031992
Publication Date: 07.03.2019 International Filing Date: 29.08.2018
IPC:
B05C 5/02 (2006.01) ,B05C 9/04 (2006.01) ,B05C 13/02 (2006.01) ,B05D 1/26 (2006.01) ,B05D 7/00 (2006.01) ,H01G 11/52 (2013.01) ,H01M 2/16 (2006.01)
B PERFORMING OPERATIONS; TRANSPORTING
05
SPRAYING OR ATOMISING IN GENERAL; APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TO SURFACES, IN GENERAL
C
APPARATUS FOR APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TO SURFACES, IN GENERAL
5
Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work
02
from an outlet device in contact, or almost in contact, with the work
B PERFORMING OPERATIONS; TRANSPORTING
05
SPRAYING OR ATOMISING IN GENERAL; APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TO SURFACES, IN GENERAL
C
APPARATUS FOR APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TO SURFACES, IN GENERAL
9
Apparatus or plant for applying liquid or other fluent material to surfaces by means not covered by groups B05C1/-B05C7/159
04
for applying liquid or other fluent material to opposite sides of the work
B PERFORMING OPERATIONS; TRANSPORTING
05
SPRAYING OR ATOMISING IN GENERAL; APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TO SURFACES, IN GENERAL
C
APPARATUS FOR APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TO SURFACES, IN GENERAL
13
Means for manipulating or holding work, e.g. for separate articles
02
for particular articles
B PERFORMING OPERATIONS; TRANSPORTING
05
SPRAYING OR ATOMISING IN GENERAL; APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TO SURFACES, IN GENERAL
D
PROCESSES FOR APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TO SURFACES, IN GENERAL
1
Processes for applying liquids or other fluent materials
26
performed by applying the liquid or other fluent material from an outlet device in contact with, or almost in contact with, the surface
B PERFORMING OPERATIONS; TRANSPORTING
05
SPRAYING OR ATOMISING IN GENERAL; APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TO SURFACES, IN GENERAL
D
PROCESSES FOR APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TO SURFACES, IN GENERAL
7
Processes, other than flocking, specially adapted for applying liquids or other fluent materials to particular surfaces or for applying particular liquids or other fluent materials
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
G
CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
11
Hybrid capacitors, i.e. capacitors having different positive and negative electrodes; Electric double-layer [EDL] capacitors; Processes for the manufacture thereof or of parts thereof
52
Separators
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
M
PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
2
Constructional details, or processes of manufacture, of the non-active parts
14
Separators; Membranes; Diaphragms; Spacing elements
16
characterised by the material
Applicants:
東レ株式会社 TORAY INDUSTRIES, INC. [JP/JP]; 東京都中央区日本橋室町2丁目1番1号 1-1, Nihonbashi-Muromachi 2-chome, Chuo-ku, Tokyo 1038666, JP
Inventors:
木ノ下 英樹 KINOSHITA Hideki; JP
佐久間 勇 SAKUMA Isamu; JP
守屋 豪 MORIYA Go; JP
Agent:
特許業務法人栄光特許事務所 EIKOH PATENT FIRM, P.C.; 東京都港区西新橋一丁目7番13号 虎ノ門イーストビルディング10階 Toranomon East Bldg. 10F, 7-13, Nishi-Shimbashi 1-chome, Minato-ku, Tokyo 1050003, JP
Priority Data:
2017-16524130.08.2017JP
Title (EN) POLYMER FILM FORMING DEVICE, POLYMER FILM FORMING METHOD, AND SEPARATOR MANUFACTURING METHOD
(FR) DISPOSITIF DE FORMATION DE FILM POLYMÈRE, PROCÉDÉ DE FORMATION DE FILM POLYMÈRE ET PROCÉDÉ DE PRODUCTION DE SÉPARATEUR
(JA) 高分子膜形成装置、高分子膜形成方法およびセパレータの製造方法
Abstract:
(EN) This polymer film forming device is provided with: a slit die (2) in which a slit (7) is formed to apply a polymer solution-containing coating liquid to a web (1) which is conveyed in the downward direction; and a means for bringing a film made of the coating liquid applied on the surface of the web (1) to come into contact with a non-solvent, wherein the slit die (2) is installed such that among slit die tip portions (8) including an upstream-side die tip portion (8a) and a downstream-side die tip portion (8b) in the conveying direction of the web (1), only the upstream-side die (3) tip portion is in contact with the web (1), and a member for supporting the web (1) with the web (1) therebetween is not disposed at a position facing the slit die tip portions (8).
(FR) L'invention concerne un dispositif de formation de film polymère, comportant : une filière à fente (2), dans laquelle une fente (7) est formée en vue d'appliquer un liquide de revêtement contenant une solution polymère à une bande (1) qui est transportée dans la direction vers le bas ; et un moyen destiné à amener un film constitué du liquide de revêtement appliqué sur la surface de la bande (1) à entrer en contact avec un non-solvant, la filière à fente (2) étant logée de sorte que, parmi des parties de pointe de filière à fente (8) comprenant une partie de pointe de filière côté amont (8a) et une partie de pointe de filière côté aval (8b) dans la direction de transport de la bande (1), seule la partie de pointe de filière côté amont (3) soit en contact avec la bande (1), et qu'un élément destiné à maintenir la bande (1) entre ces dernières ne soit pas disposé à une position faisant face aux parties de pointe de filière à fente (8).
(JA) 下方向に搬送されるウェブ(1)に高分子溶液を含む塗工液を塗布するために、内部にスリット(7)が形成されたスリットダイ(2)と、ウェブ(1)の表面に塗布された塗工液からなる塗膜を非溶媒に接触させる手段と、を備え、前記スリットダイ(2)は、ウェブ(1)の搬送方向における上流側ダイ先端部(8a)及び下流側ダイ先端部(8b)を含むスリットダイ先端部(8)のうち、前記上流側ダイ(3)先端部のみがウェブに接触するように設置されており、前記スリットダイ先端部(8)の対向位置に、前記ウェブ(1)を介して前記ウェブ(1)を支持する部材が配置されていないことを特徴とする高分子膜形成装置。
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Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JO, JP, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)