Some content of this application is unavailable at the moment.
If this situation persist, please contact us atFeedback&Contact
1. (WO2019044882) POLYAMIDE RESIN AND FILM FORMED FROM SAME
Latest bibliographic data on file with the International Bureau    Submit observation

Pub. No.: WO/2019/044882 International Application No.: PCT/JP2018/031896
Publication Date: 07.03.2019 International Filing Date: 29.08.2018
IPC:
C08G 69/36 (2006.01) ,C08J 5/18 (2006.01)
C CHEMISTRY; METALLURGY
08
ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
G
MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
69
Macromolecular compounds obtained by reactions forming a carboxylic amide link in the main chain of the macromolecule
02
Polyamides derived from amino carboxylic acids or from polyamines and polycarboxylic acids
36
derived from amino acids, polyamines, and polycarboxylic acids
C CHEMISTRY; METALLURGY
08
ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
J
WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H142
5
Manufacture of articles or shaped materials containing macromolecular substances
18
Manufacture of films or sheets
Applicants:
宇部興産株式会社 UBE INDUSTRIES, LTD. [JP/JP]; 山口県宇部市大字小串1978番地の96 1978-96, Oaza Kogushi, Ube-shi, Yamaguchi 7558633, JP
Inventors:
中川 知之 NAKAGAWA Tomoyuki; JP
花岡 康成 HANAOKA Yasunari; JP
和田 秀作 WADA Shusaku; JP
Agent:
特許業務法人 津国 TSUKUNI & ASSOCIATES; 東京都千代田区麹町5-3-1 麹町ビジネスセンター Kojimachi Business Center, 5-3-1, Kojimachi, Chiyoda-ku, Tokyo 1020083, JP
山村 大介 YAMAMURA Daisuke; JP
Priority Data:
2017-16709531.08.2017JP
Title (EN) POLYAMIDE RESIN AND FILM FORMED FROM SAME
(FR) RÉSINE POLYAMIDE ET FILM FORMÉ À PARTIR DE CELLE-CI
(JA) ポリアミド樹脂及びそれからなるフィルム
Abstract:
(EN) Provided are a polyamide resin for shrink wrap and a film thereof, the polyamide resin containing at least three types of units, including a (A) unit derived from a lactam and/or an aminocarboxylic acid, and a (B) unit derived from a diamine-dicarboxylic acid equimolar salt, wherein the (B) unit derived from a diamine-dicarboxylic acid equimolar salt includes a (B-1) unit which does not have an aromatic ring structure and a (B-2) unit which has an aromatic ring structure.
(FR) L'invention concerne une résine polyamide pour emballage rétractable et un film de celle-ci, la résine polyamide contenant au moins trois types d'unités, comprenant une unité (A) dérivée d'un lactame et/ou d'un acide aminocarboxylique, et une unité (B) dérivée d'un sel équimolaire d'acide diamine-dicarboxylique, l'unité (B) dérivée d'un sel équimolaire d'acide diamine-dicarboxylique comprenant une unité (B-1) qui ne présente pas de structure cyclique aromatique et une unité (B-2) qui a une structure cyclique aromatique.
(JA) 3種以上の単位を含み、(A)ラクタム及び/又はアミノカルボン酸に由来する単位並びに(B)ジアミン及びジカルボン酸の等モル塩に由来する単位を含み、前記(B)ジアミン及びジカルボン酸の等モル塩に由来する単位は、(B-1)芳香環構造を有さない単位及び(B-2)芳香環構造を有する単位を含む、シュリンクフィルム用ポリアミド樹脂又はそのフィルムである。
Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JO, JP, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)