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1. (WO2019044840) METHOD FOR MANUFACTURING SUBSTRATE EQUIPPED WITH TRANSPARENT CONDUCTIVE FILM, SUBSTRATE EQUIPPED WITH TRANSPARENT CONDUCTIVE FILM, AND SOLAR CELL
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Pub. No.: WO/2019/044840 International Application No.: PCT/JP2018/031781
Publication Date: 07.03.2019 International Filing Date: 28.08.2018
IPC:
H01B 13/00 (2006.01) ,B23K 26/00 (2014.01) ,B23K 26/351 (2014.01) ,B32B 7/02 (2006.01) ,B32B 38/18 (2006.01) ,H01B 5/14 (2006.01) ,H05K 3/08 (2006.01) ,H01L 31/0224 (2006.01)
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
B
CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
13
Apparatus or processes specially adapted for manufacturing conductors or cables
B PERFORMING OPERATIONS; TRANSPORTING
23
MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
K
SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
26
Working by laser beam, e.g. welding, cutting, boring
[IPC code unknown for B23K 26/351]
B PERFORMING OPERATIONS; TRANSPORTING
32
LAYERED PRODUCTS
B
LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
7
Layered products characterised by the relation between layers, i.e. products essentially comprising layers having different physical properties or products characterised by the interconnection of layers
02
in respect of physical properties, e.g. hardness
B PERFORMING OPERATIONS; TRANSPORTING
32
LAYERED PRODUCTS
B
LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
38
Ancillary operations in connection with laminating processes
18
Handling of layers or the laminate
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
B
CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
5
Non-insulated conductors or conductive bodies characterised by their form
14
comprising conductive layers or films on insulating-supports
H ELECTRICITY
05
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
K
PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
3
Apparatus or processes for manufacturing printed circuits
02
in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
08
the conductive material being removed by electric discharge, e.g. by spark erosion
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
31
Semiconductor devices sensitive to infra-red radiation, light, electromagnetic radiation of shorter wavelength, or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
02
Details
0224
Electrodes
Applicants:
古河電気工業株式会社 FURUKAWA ELECTRIC CO., LTD. [JP/JP]; 東京都千代田区丸の内二丁目2番3号 2-3, Marunouchi 2-chome, Chiyoda-ku, Tokyo 1008322, JP
Inventors:
岩間 真木 IWAMA, Masaki; JP
Agent:
特許業務法人酒井国際特許事務所 SAKAI INTERNATIONAL PATENT OFFICE; 東京都千代田区霞が関3丁目8番1号 虎の門三井ビルディング Toranomon Mitsui Building, 8-1, Kasumigaseki 3-chome, Chiyoda-ku, Tokyo 1000013, JP
Priority Data:
2017-16474329.08.2017JP
Title (EN) METHOD FOR MANUFACTURING SUBSTRATE EQUIPPED WITH TRANSPARENT CONDUCTIVE FILM, SUBSTRATE EQUIPPED WITH TRANSPARENT CONDUCTIVE FILM, AND SOLAR CELL
(FR) PROCÉDÉ DE FABRICATION D'UN SUBSTRAT ÉQUIPÉ D'UN FILM CONDUCTEUR TRANSPARENT, SUBSTRAT ÉQUIPÉ D'UN FILM CONDUCTEUR TRANSPARENT, ET CELLULE SOLAIRE
(JA) 透明導電膜付基板の製造方法、透明導電膜付基板及び太陽電池
Abstract:
(EN) Provided is a method for manufacturing a substrate equipped with a transparent conductive film, wherein a sub-nanosecond to nanosecond laser beam is emitted on a transparent conductive film formed on the surface of a substrate so as to form a laser-induced periodic surface structure having a protruding and recessed shape in at least a portion of the transparent conductive film. Preferably, the fluence of the sub-nanosecond to nanosecond laser beam is controlled such that at least a portion of the sub-nanosecond to nanosecond laser beam has a fluence value that falls between a fluence with which it is possible to remove the transparent conductive film and a fluence with which it is impossible to remove the transparent conductive film.
(FR) Cette invention concerne un procédé de fabrication d'un substrat équipé d'un film conducteur transparent. Selon ledit procédé, un faisceau laser à impulsions de l'ordre sous-nanoseconde à nanoseconde est émis sur un film conducteur transparent formé sur la surface d'un substrat de manière à former une structure de surface périodique induite par laser ayant une forme à saillies et à évidements dans au moins une partie du film conducteur transparent. De préférence, la fluence du faisceau laser à impulsions de l'ordre sous-nanoseconde à nanoseconde est commandée de telle sorte qu'au moins une partie du faisceau laser à impulsions de l'ordre sous-nanoseconde à nanoseconde a une valeur de fluence qui se situe entre une fluence avec laquelle il est possible d'éliminer le film conducteur transparent et une fluence avec laquelle il est impossible d'éliminer le film conducteur transparent.
(JA) 透明導電膜付基板の製造方法であって、サブナノ-ナノ秒レーザ光を、基板の表面に形成された透明導電膜に照射して、前記透明導電膜の少なくとも一部に、凹凸形状のレーザ誘起周期表面構造を形成する。好ましくは、前記透明導電膜での照射面における、前記サブナノ-ナノ秒レーザ光のビームの少なくとも一部が、前記透明導電膜を除去できるフルエンスと前記透明導電膜を除去できないフルエンスとの間の値となるように、前記サブナノ-ナノ秒レーザ光のフルエンスを制御する。
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Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JO, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)