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1. (WO2019044830) ELECTROCONDUCTIVE MEMBER JOINED BODY, JOINING METHOD, AND METHOD FOR OPTIMIZING INTERMEDIATE MEMBER
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Pub. No.: WO/2019/044830 International Application No.: PCT/JP2018/031765
Publication Date: 07.03.2019 International Filing Date: 28.08.2018
IPC:
B23K 1/00 (2006.01) ,B23K 1/19 (2006.01) ,H01R 4/02 (2006.01) ,H01R 43/02 (2006.01)
B PERFORMING OPERATIONS; TRANSPORTING
23
MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
K
SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
1
Soldering, e.g. brazing, or unsoldering
B PERFORMING OPERATIONS; TRANSPORTING
23
MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
K
SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
1
Soldering, e.g. brazing, or unsoldering
19
taking account of the properties of the materials to be soldered
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
R
ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
4
Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
02
Soldered or welded connections
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
R
ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
43
Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
02
for soldered or welded connections
Applicants:
矢崎総業株式会社 YAZAKI CORPORATION [JP/JP]; 東京都港区三田一丁目4番28号 4-28, Mita 1-chome, Minato-ku, Tokyo 1088333, JP
Inventors:
山形 由紀 YAMAGATA Yoshinori; JP
杉山 善崇 SUGIYAMA Yoshitaka; JP
▲高▼橋 宏和 TAKAHASHI Hirokazu; JP
Agent:
三好 秀和 MIYOSHI Hidekazu; JP
高橋 俊一 TAKAHASHI Shunichi; JP
伊藤 正和 ITO Masakazu; JP
高松 俊雄 TAKAMATSU Toshio; JP
Priority Data:
2017-16916304.09.2017JP
Title (EN) ELECTROCONDUCTIVE MEMBER JOINED BODY, JOINING METHOD, AND METHOD FOR OPTIMIZING INTERMEDIATE MEMBER
(FR) CORPS ASSEMBLÉ D'ÉLÉMENTS ÉLECTROCONDUCTEURS, PROCÉDÉ D'ASSEMBLAGE ET PROCÉDÉ D'OPTIMISATION D'ÉLÉMENT INTERMÉDIAIRE
(JA) 導電部材の接合体、接合方法および中間部材の最適化方法
Abstract:
(EN) Provided are an electroconductive member joined body, a joining method, and a method for optimizing an intermediate member, in which: the joined body includes a first electroconductive member (W1) that is configured from a first metal (M1), a second electroconductive member (W1) that is configured from a second metal (M2), and an intermediate member that is configured from a third metal (M3) and joins together end surfaces of the first electroconductive member and the second electroconductive member; the intermediate member is configured from a cap member (C1) comprising hollow engagement parts (101, 102) that have an inside diameter obtained by estimating the difference between the nominal cross-sectional area and the actual cross-sectional area of the first electroconductive member and the second electroconductive member; the joining interface of the intermediate member and the first electroconductive area, or the area around said joining interface, is configured from a first solid solution that is a solid solution of the first metal and the third metal; and the joining interface of the intermediate member and the second electroconductive member, or the area around said joining interface, is configured from a second solid solution that is a solid solution of the second metal and the third metal.
(FR) L'invention concerne un corps assemblé d'éléments électroconducteurs, un procédé d'assemblage et un procédé d'optimisation d'un élément intermédiaire, dans lequel : le corps assemblé comprend un premier élément électroconducteur (W1) qui est conçu à partir d'un premier métal (M1), un second élément électroconducteur (W1) qui est conçu à partir d'un deuxième métal (M2), et un élément intermédiaire qui est conçu à partir d'un troisième métal (M3) et qui assemble les surfaces d'extrémité du premier élément électroconducteur et du second élément électroconducteur ; l'élément intermédiaire est conçu à partir d'un élément capuchon (C1) comprenant des parties de mise en prise creuses (101, 102) qui ont un diamètre intérieur obtenu par estimation de la différence entre la surface de section transversale nominale et la surface de section transversale réelle du premier élément électroconducteur et du second élément électroconducteur ; l'interface d'assemblage de l'élément intermédiaire et de la première zone électroconductrice, ou la zone autour de ladite interface d'assemblage, est conçue à partir d'une première solution solide qui est une solution solide du premier métal et du troisième métal ; et l'interface d'assemblage de l'élément intermédiaire et du second élément électroconducteur, ou la zone autour de ladite interface d'assemblage, est conçue à partir d'une seconde solution solide qui est une solution solide du deuxième métal et du troisième métal.
(JA) 第1金属(M1)で構成される第1導電部材(W1)、第2金属(M2)で構成される第2導電部材(W1)、第1導電部材と第2導電部材との端面同士を接合する第3金属(M3)で構成される中間部材を含み、中間部材は、第1導電部材および第2導電部材の公称断面積と実際の断面積との差を見込んだ内径を有する窪み状の係合部(101、102)を備えたキャップ部材(C1)で構成され、中間部材と第1導電部材との接合界面または接合界面の近傍領域は、第1金属と第3金属との固溶体である第1固溶体で構成され、中間部材と第2導電部材との接合界面または接合界面の近傍領域は、第2金属と第3金属との固溶体である第2固溶体で構成される接合体に関する導電部材の接合体、接合方法および中間部材の最適化方法。
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Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JO, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)