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1. (WO2019044828) ELECTROCONDUCTIVE MEMBER JOINED BODY AND JOINING METHOD
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Pub. No.: WO/2019/044828 International Application No.: PCT/JP2018/031763
Publication Date: 07.03.2019 International Filing Date: 28.08.2018
IPC:
B23K 1/00 (2006.01) ,B23K 1/19 (2006.01) ,H01R 4/02 (2006.01) ,H01R 43/02 (2006.01)
B PERFORMING OPERATIONS; TRANSPORTING
23
MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
K
SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
1
Soldering, e.g. brazing, or unsoldering
B PERFORMING OPERATIONS; TRANSPORTING
23
MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
K
SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
1
Soldering, e.g. brazing, or unsoldering
19
taking account of the properties of the materials to be soldered
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
R
ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
4
Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
02
Soldered or welded connections
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
R
ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
43
Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
02
for soldered or welded connections
Applicants:
矢崎総業株式会社 YAZAKI CORPORATION [JP/JP]; 東京都港区三田一丁目4番28号 4-28, Mita 1-chome, Minato-ku, Tokyo 1088333, JP
Inventors:
山形 由紀 YAMAGATA Yoshinori; JP
▲高▼橋 宏和 TAKAHASHI Hirokazu; JP
Agent:
三好 秀和 MIYOSHI Hidekazu; JP
高橋 俊一 TAKAHASHI Shunichi; JP
伊藤 正和 ITO Masakazu; JP
高松 俊雄 TAKAMATSU Toshio; JP
Priority Data:
2017-16842101.09.2017JP
Title (EN) ELECTROCONDUCTIVE MEMBER JOINED BODY AND JOINING METHOD
(FR) CORPS ASSEMBLÉ D'ÉLÉMENT ÉLECTROCONDUCTEUR ET PROCÉDÉ D'ASSEMBLAGE
(JA) 導電部材の接合体および接合方法
Abstract:
(EN) Provided are an electroconductive member joined body and a joining method, in which: the joined body includes a first electroconductive member (W1) that is configured from a first metal (M1), a second electroconductive member (W2) that is configured from a second metal (M2), and an intermediate member (C1) that is configured from a third metal (M3) and joins together end surfaces of the first electroconductive member and the second electroconductive member; the intermediate member is configured from a cap member having hollow engagement parts (101, 102) that are fitted to the outer peripheral diameter of the first electroconductive member and/or the second electroconductive member; the joining interface (L1) of the intermediate member and the first electroconductive member, or the area around said joining interface, is configured from a solid solution (S1a) of the first metal and the third metal; and the joining interface (L2) of the intermediate member and the second electroconductive member, or the area around said joining interface, is configured from a solid solution (S1b) of the second metal and the third metal.
(FR) L'invention concerne un corps assemblé d'élément électroconducteur et un procédé d'assemblage, dans lesquels : le corps assemblé comprend un premier élément électroconducteur (W1) qui est conçu à partir d'un premier métal (M1), un second élément électroconducteur (W2) qui est conçu à partir d'un deuxième métal (M2), et un élément intermédiaire (C1) qui est conçu à partir d'un troisième métal (M3) et assemble entre elles des surfaces d'extrémité du premier élément électroconducteur et du second élément électroconducteur ; l'élément intermédiaire est conçu à partir d'un élément capuchon ayant des parties de mise en prise creuses (101, 102) qui sont ajustés sur le diamètre périphérique externe du premier élément électroconducteur et/ou du second élément électroconducteur ; l'interface d'assemblage (L1) de l'élément intermédiaire et du premier élément électroconducteur, ou la zone autour de ladite interface d'assemblage, est conçue à partir d'une solution solide (S1a) du premier métal et du troisième métal ; et l'interface d'assemblage (L2) de l'élément intermédiaire et du deuxième élément électroconducteur, ou la zone autour de ladite interface d'assemblage, est conçue à partir d'une solution solide (S1b) du deuxième métal et du troisième métal.
(JA) 第1金属(M1)で構成される第1導電部材(W1)と、第2金属(M2)で構成される第2導電部材(W2)と、第1導電部材と第2導電部材との端面同士を接合する第3金属(M3)で構成される中間部材(C1)と、を含み、中間部材は、第1導電部材と第2導電部材の少なくとも一方の外周径に合わせた窪み状の係合部(101、102)を有するキャップ部材で構成され、中間部材と第1導電部材との接合界面(L1)または接合界面の近傍領域は、第1金属と第3金属との固溶体(S1a)で構成され、中間部材と第2導電部材との接合界面(L2)または接合界面の近傍領域は、第2金属と前記第3金属との固溶体(S1b)で構成される接合体に関する、導電部材の接合体およびその接合方法。
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Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JO, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)