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1. (WO2019044819) DEVICE AND METHOD FOR LINEARLY MOVING MOVABLE BODY RELATIVE TO OBJECT
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Pub. No.: WO/2019/044819 International Application No.: PCT/JP2018/031744
Publication Date: 07.03.2019 International Filing Date: 28.08.2018
IPC:
H01L 21/60 (2006.01) ,H01L 21/52 (2006.01) ,H01L 21/68 (2006.01) ,H05K 13/04 (2006.01)
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21
Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
02
Manufacture or treatment of semiconductor devices or of parts thereof
04
the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer, carrier concentration layer
50
Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the groups H01L21/06-H01L21/326162
60
Attaching leads or other conductive members, to be used for carrying current to or from the device in operation
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21
Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
02
Manufacture or treatment of semiconductor devices or of parts thereof
04
the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer, carrier concentration layer
50
Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the groups H01L21/06-H01L21/326162
52
Mounting semiconductor bodies in containers
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21
Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
67
Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components
68
for positioning, orientation or alignment
H ELECTRICITY
05
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
K
PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
13
Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
04
Mounting of components
Applicants:
株式会社新川 SHINKAWA LTD. [JP/JP]; 東京都武蔵村山市伊奈平2丁目51番地の1 51-1, Inadaira 2-chome, Musashimurayama-shi, Tokyo 2088585, JP
Inventors:
瀬山 耕平 SEYAMA, Kohei; JP
歌野 哲弥 UTANO, Tetsuya; JP
野口 勇一郎 NOGUCHI, Yuichiro; JP
Agent:
特許業務法人YKI国際特許事務所 YKI INTELLECTUAL PROPERTY ATTORNEYS; 東京都武蔵野市吉祥寺本町一丁目34番12号 1-34-12, Kichijoji-Honcho, Musashino-shi, Tokyo 1800004, JP
Priority Data:
2017-16292828.08.2017JP
Title (EN) DEVICE AND METHOD FOR LINEARLY MOVING MOVABLE BODY RELATIVE TO OBJECT
(FR) DISPOSITIF ET PROCÉDÉ DE DÉPLACEMENT LINÉAIRE D'UN CORPS MOBILE PAR RAPPORT À UN OBJET
(JA) 対象物に対して移動体を直線移動させる装置および方法
Abstract:
(EN) The present invention is provided with: a base (10) which moves linearly relative to a substrate (16) and has a first position and a second position that are spaced apart from each other by a predetermined interval in the movement direction; a linear scale (33) in which a plurality of markings having a predetermined pitch are provided along the movement direction; encoder heads (31, 32) which respectively are disposed at the first and second positions of the base (10) and detect first and second marking numbers B1(n) and B2(n) of the linear scale (33) with respect to the first and second positions, wherein, as the base (10) is moved along the linear scale (33), the first and second marking numbers B1(n) and B2(n) are detected in this order in the respective encoder heads (31, 32), and the movement amount of the base (10) is controlled on the basis of the ratio between the predetermined interval and the distance A(n) between the first marking number B1(n) and the second marking number B2(n) on the scale.
(FR) Un dispositif selon la présente invention comprend : une base (10) qui se déplace linéairement par rapport à un substrat (16) et a une première position et une seconde position qui sont espacées l'une de l'autre d'un intervalle prédéterminé dans la direction de déplacement ; une échelle linéaire (33) dans laquelle une pluralité de repères ayant un pas prédéterminé sont disposés le long de la direction de déplacement ; des têtes de codeur (31, 32) qui sont respectivement disposées aux première et seconde positions de la base (10) et détectent des premier et second chiffres de repérage B1(n) et B2(n) de l'échelle linéaire (33) par rapport aux première et seconde positions. Au fur et à mesure que la base (10) est déplacée le long de l'échelle linéaire (33), les premier et second chiffres de repérage B1(n) et B2(n) sont détectés dans cet ordre dans les têtes de codeur respectives (31, 32), et la grandeur de déplacement de la base (10) est contrôlée sur la base du rapport entre l'intervalle prédéterminé et la distance A(n) entre le premier chiffre de repérage B1(n) et le second chiffre de repérage B2(n) sur l'échelle.
(JA) 基板(16)に対して直線移動し、移動方向に所定間隔aを空けた第1位置と第2位置とを有するベース(10)と、移動方向に沿って所定ピッチで複数の目盛が設けられたリニアスケール(33)と、ベース(10)の第1、第2位置に配置され、第1、第2位置に対するリニアスケール(33)の第1、第2目盛番号B1(n)、B2(n)を検出する各エンコーダヘッド(31,32)と、を備え、ベース(10)をリニアスケール(33)に沿って移動させながら、逐次、各エンコーダヘッド(31,32)で第1、第2目盛番号B1(n)、B2(n)を検出し、所定間隔aと第1目盛番号B1(n)と第2目盛番号B2(n)との間のスケール上の距離A(n)との比率に基づいて、ベース(10)の移動量を制御する。
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Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JO, JP, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)