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1. (WO2019044817) NEGATIVE PHOTOSENSITIVE RESIN COMPOSITION, SEMICONDUCTOR DEVICE AND ELECTRONIC DEVICE
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Pub. No.: WO/2019/044817 International Application No.: PCT/JP2018/031738
Publication Date: 07.03.2019 International Filing Date: 28.08.2018
IPC:
G03F 7/038 (2006.01) ,G03F 7/004 (2006.01) ,G03F 7/075 (2006.01)
G PHYSICS
03
PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
F
PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
7
Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printed surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
004
Photosensitive materials
038
Macromolecular compounds which are rendered insoluble or differentially wettable
G PHYSICS
03
PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
F
PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
7
Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printed surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
004
Photosensitive materials
04
Chromates
G PHYSICS
03
PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
F
PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
7
Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printed surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
004
Photosensitive materials
075
Silicon-containing compounds
Applicants:
住友ベークライト株式会社 SUMITOMO BAKELITE CO., LTD. [JP/JP]; 東京都品川区東品川2丁目5番8号 5-8, Higashi-shinagawa 2-chome, Shinagawa-ku, Tokyo 1400002, JP
Inventors:
鈴木 咲子 SUZUKI, Sakiko; JP
山川 雄大 YAMAKAWA, Yuta; JP
高橋 泰典 TAKAHASHI, Yasunori; JP
Agent:
朝比 一夫 ASAHI, Kazuo; JP
増田 達哉 MASUDA, Tatsuya; JP
Priority Data:
2017-16370428.08.2017JP
Title (EN) NEGATIVE PHOTOSENSITIVE RESIN COMPOSITION, SEMICONDUCTOR DEVICE AND ELECTRONIC DEVICE
(FR) COMPOSITION DE RÉSINE PHOTOSENSIBLE NÉGATIVE, DISPOSITIF À SEMI-CONDUCTEUR ET DISPOSITIF ÉLECTRONIQUE
(JA) ネガ型感光性樹脂組成物、半導体装置および電子機器
Abstract:
(EN) This negative photosensitive resin composition contains a thermosetting resin, a photopolymerization initiator and a coupling agent which contains an acid anhydride as a functional group. It is preferable that the thermosetting resin contains a polyfunctional epoxy resin. It is also preferable that the content of the polyfunctional epoxy resin is 40-80% by mass relative to the nonvolatile components of the negative photosensitive resin composition. It is also preferable that the coupling agent is a compound containing an alkoxysilyl group, which comprises succinic acid anhydride as a functional group.
(FR) La présente invention concerne une composition de résine photosensible négative qui contient une résine thermodurcissable, un amorceur de photopolymérisation et un agent de couplage qui contient un anhydride d'acide en tant que groupe fonctionnel. Il est préférable que la résine thermodurcissable contienne une résine époxyde polyfonctionnelle. Il est également préférable que la teneur de la résine époxyde polyfonctionnelle soit de 40% à 80% en masse par rapport aux composants non volatils de la composition de résine photosensible négative. Il est également préférable que l'agent de couplage soit un composé contenant un groupe alcoxysilyle, qui comprend de l'anhydride d'acide succinique en tant que groupe fonctionnel.
(JA) 本発明のネガ型感光性樹脂組成物は、熱硬化性樹脂と、光重合開始剤と、官能基として酸無水物を含有するカップリング剤と、を含む。このうち、熱硬化性樹脂は、多官能エポキシ樹脂を含んでいることが好ましい。また、多官能エポキシ樹脂の含有量は、ネガ型感光性樹脂組成物の不揮発成分に対して40~80質量%であることが好ましい。また、カップリング剤は、官能基としてコハク酸無水物を有する、アルコキシシリル基を含む化合物であることが好ましい。
Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JO, JP, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)