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1. (WO2019044816) DEVICE AND METHOD FOR LINEARLY MOVING FIRST AND SECOND MOVING BODIES RELATIVE TO TARGET OBJECT
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Pub. No.: WO/2019/044816 International Application No.: PCT/JP2018/031737
Publication Date: 07.03.2019 International Filing Date: 28.08.2018
IPC:
H01L 21/60 (2006.01) ,H01L 21/52 (2006.01) ,H01L 21/67 (2006.01) ,H05K 13/04 (2006.01)
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21
Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
02
Manufacture or treatment of semiconductor devices or of parts thereof
04
the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer, carrier concentration layer
50
Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the groups H01L21/06-H01L21/326162
60
Attaching leads or other conductive members, to be used for carrying current to or from the device in operation
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21
Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
02
Manufacture or treatment of semiconductor devices or of parts thereof
04
the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer, carrier concentration layer
50
Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the groups H01L21/06-H01L21/326162
52
Mounting semiconductor bodies in containers
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21
Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
67
Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components
H ELECTRICITY
05
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
K
PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
13
Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
04
Mounting of components
Applicants:
株式会社新川 SHINKAWA LTD. [JP/JP]; 東京都武蔵村山市伊奈平2丁目51番地の1 51-1, Inadaira 2-chome, Musashimurayama-shi, Tokyo 2088585, JP
Inventors:
瀬山 耕平 SEYAMA, Kohei; JP
歌野 哲弥 UTANO, Tetsuya; JP
野口 勇一郎 NOGUCHI, Yuichiro; JP
Agent:
特許業務法人YKI国際特許事務所 YKI INTELLECTUAL PROPERTY ATTORNEYS; 東京都武蔵野市吉祥寺本町一丁目34番12号 1-34-12, Kichijoji-Honcho, Musashino-shi, Tokyo 1800004, JP
Priority Data:
2017-16311028.08.2017JP
Title (EN) DEVICE AND METHOD FOR LINEARLY MOVING FIRST AND SECOND MOVING BODIES RELATIVE TO TARGET OBJECT
(FR) DISPOSITIF ET PROCÉDÉ DE DÉPLACEMENT LINÉAIRE D'UN PREMIER ET D'UN SECOND CORPS MOBILE PAR RAPPORT À UN OBJET CIBLE
(JA) 対象物に対して第1移動体及び第2移動体を直線移動させる装置及び方法
Abstract:
(EN) The present invention is provided with: first and second bases (10, 20), which are guided by a guide rail to thereby linearly move; a linear scale (33) provided with scales (34) at predetermined pitches in the moving direction; and first and second encoder heads (17, 27) attached to the first and second bases (10, 20). In the present invention, while maintaining, at a predetermined distance a, a distance between the first and second encoder heads (17, 27), and moving the first and second bases (10, 20) along the guide rail, first and second scale numbers B1(n), B2(n), at which the first and second encoder heads (17, 27) are positioned, are sequentially detected from the first and second encoder heads (17, 27), and the amount of movement of the first and second bases (10, 20) is controlled on the basis of the ratio between the predetermined gap a and the distance A(n) on the scale between the first scale numbers B1(n) and the second scale numbers B2(n).
(FR) Un dispositif selon la présente invention comprend : des première et seconde bases (10, 20), qui sont guidées par un rail de guidage de sorte à se déplacer linéairement ; une échelle linéaire (33) comportant des graduations (34) à des pas prédéterminés dans la direction de déplacement ; et des première et seconde têtes de codeur (17, 27) fixées aux première et seconde bases (10, 20). Selon la présente invention, lorsqu'une distance entre les première et seconde têtes de codeur (17, 27) est maintenue à une distance prédéterminée, et les première et seconde bases (10, 20) sont déplacées le long du rail de guidage, des premier et second chiffres de graduation B1(n), B2(n), sur lesquels les première et seconde têtes de codeur (17, 27) sont positionnés, sont séquentiellement détectés à partir des première et seconde têtes de codeur (17, 27), et la grandeur de déplacement des première et seconde bases (10, 20) est contrôlée sur la base du rapport entre l'espace prédéterminé (a) et la distance A(n) sur l'échelle entre les premiers chiffres de graduation B1(n) et les seconds chiffres de graduation B2(n).
(JA) ガイドレールにガイドされて直線移動する第1、第2ベース(10、20)と、移動方向に沿って所定ピッチで目盛(34)が設けられたリニアスケール(33)と、第1、第2ベース(10、20)に取り付けられる第1、第2エンコーダヘッド(17、27)と、第1、第2エンコーダヘッド(17、27)の間隔を所定間隔aに保持して第1、第2ベース(10、20)をガイドレールに沿って移動させながら、逐次、第1、第2エンコーダヘッド(17、27)で第1、第2エンコーダヘッド(17、27)が位置する第1、第2目盛番号B1(n)、B2(n)を検出し、所定間隔aと第1目盛番号B1(n)と第2目盛番号B2(n)との間のスケール上の距離A(n)との比率に基づいて、第1、第2ベース(10、20)の移動量を制御する。
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Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JO, JP, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)