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1. (WO2019044803) EPOXY RESIN MODIFYING AGENT
Latest bibliographic data on file with the International Bureau    Submit observation

Pub. No.: WO/2019/044803 International Application No.: PCT/JP2018/031690
Publication Date: 07.03.2019 International Filing Date: 28.08.2018
IPC:
C08G 59/40 (2006.01) ,C08L 63/00 (2006.01) ,G03F 7/004 (2006.01) ,G03F 7/027 (2006.01) ,G03F 7/032 (2006.01) ,G03F 7/035 (2006.01) ,H05K 3/28 (2006.01)
C CHEMISTRY; METALLURGY
08
ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
G
MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
59
Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by reaction of epoxy polycondensates with monofunctional low-molecular-weight compounds; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
18
Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
40
characterised by the curing agents used
C CHEMISTRY; METALLURGY
08
ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
L
COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
63
Compositions of epoxy resins; Compositions of derivatives of epoxy resins
G PHYSICS
03
PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
F
PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
7
Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printed surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
004
Photosensitive materials
04
Chromates
G PHYSICS
03
PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
F
PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
7
Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printed surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
004
Photosensitive materials
027
Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
G PHYSICS
03
PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
F
PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
7
Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printed surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
004
Photosensitive materials
027
Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
032
with binders
G PHYSICS
03
PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
F
PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
7
Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printed surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
004
Photosensitive materials
027
Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
032
with binders
035
the binders being polyurethanes
H ELECTRICITY
05
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
K
PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
3
Apparatus or processes for manufacturing printed circuits
22
Secondary treatment of printed circuits
28
Applying non-metallic protective coatings
Applicants:
DIC株式会社 DIC CORPORATION [JP/JP]; 東京都板橋区坂下三丁目35番58号 35-58, Sakashita 3-chome, Itabashi-ku, Tokyo 1748520, JP
Inventors:
松村 優佑 MATSUMURA Yuusuke; JP
中村 昭文 NAKAMURA Akifumi; JP
Agent:
小川 眞治 OGAWA Shinji; JP
Priority Data:
2017-16560130.08.2017JP
Title (EN) EPOXY RESIN MODIFYING AGENT
(FR) AGENT DE MODIFICATION DE RÉSINE ÉPOXYDIQUE
(JA) エポキシ樹脂改質剤
Abstract:
(EN) The present invention addresses the problem of providing a composition which enables the production of a cured product that is capable of achieving a good balance between heat resistance and decrease of elastic modulus, while exhibiting excellent adhesion to a copper foil. The present invention uses an active energy ray curable composition which contains an acid group-containing epoxy (meth)acrylate resin, an epoxy curing agent and a modified resin, and which is characterized in that: the modified resin has at least one specific functional group that is selected from the group consisting of a hydroxyl group and a carboxy group; the glass transition temperature of the modified resin is from -100°C to 50°C (inclusive); and the number average molecular weight of the modified resin is from 600 to 50,000 (inclusive).
(FR) La présente invention aborde le problème consistant à fournir une composition qui permet la production d'un produit durci qui est apte à atteindre un bon équilibre entre la résistance à la chaleur et la diminution du module élastique, tout en présentant une excellente adhérence à une feuille de cuivre. La présente invention utilise une composition durcissable par rayonnement d'énergie active qui contient une résine époxydique (méth)acrylate contenant un groupe acide, un agent de durcissement époxydique et une résine modifiée et qui est caractérisé en ce que : la résine modifiée a au moins un groupe fonctionnel spécifique qui est choisi dans le groupe constitué d'un groupe hydroxyle et d'un groupe carboxy ; la température de transition vitreuse de la résine modifiée est comprise entre -100 °C et 50 °C (inclus) ; et le poids moléculaire moyen en nombre de la résine modifiée est de 600 à 50 000 (inclus).
(JA) 本発明の課題は、耐熱性と低弾性率化の両立を可能とし、かつ銅箔密着性に優れた硬化物を製造可能な組成物を提供することである。本発明は、酸基含有エポキシ(メタ)アクリレート樹脂、エポキシ硬化剤及び改質樹脂を含む活性エネルギー線硬化性組成物であって、前記改質樹脂が、水酸基及びカルボキシ基よりなる群から選ばれる少なくとも1種である特定官能基を有するものであり、前記改質樹脂のガラス転移温度が、-100℃以上50℃以下であり、前記改質樹脂の数平均分子量が、600以上50,000以下であることを特徴とする活性エネルギー線硬化性組成物を用いる。
Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JO, JP, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)