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1. (WO2019044687) METHOD FOR MANUFACTURING BUS BAR ASSEMBLY
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Pub. No.: WO/2019/044687 International Application No.: PCT/JP2018/031314
Publication Date: 07.03.2019 International Filing Date: 24.08.2018
IPC:
H01B 13/00 (2006.01) ,B05D 5/12 (2006.01) ,B05D 7/14 (2006.01) ,H01B 7/00 (2006.01)
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
B
CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
13
Apparatus or processes specially adapted for manufacturing conductors or cables
B PERFORMING OPERATIONS; TRANSPORTING
05
SPRAYING OR ATOMISING IN GENERAL; APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TO SURFACES, IN GENERAL
D
PROCESSES FOR APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TO SURFACES, IN GENERAL
5
Processes for applying liquids or other fluent materials to surfaces to obtain special surface effects, finishes or structures
12
to obtain a coating with specific electrical properties
B PERFORMING OPERATIONS; TRANSPORTING
05
SPRAYING OR ATOMISING IN GENERAL; APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TO SURFACES, IN GENERAL
D
PROCESSES FOR APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TO SURFACES, IN GENERAL
7
Processes, other than flocking, specially adapted for applying liquids or other fluent materials to particular surfaces or for applying particular liquids or other fluent materials
14
to metal, e.g. car bodies
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
B
CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
7
Insulated conductors or cables characterised by their form
Applicants:
サンコール株式会社 SUNCALL CORPORATION [JP/JP]; 京都府京都市右京区梅津西浦町14番地 14, Umezu Nishiura-cho, Ukyo-ku, Kyoto-shi, Kyoto 6158555, JP
Inventors:
若林 正二郎 WAKABAYASHI Shojiro; JP
中川 雅也 NAKAGAWA Masaya; JP
Agent:
特許業務法人アローレインターナショナル ARAWORE INTERNATIONAL IP LAW FIRM; 大阪府大阪市中央区北浜2-6-26 大阪グリーンビル8階 Osaka Green Bldg. 8F, 6-26, Kitahama 2-chome, Chuo-ku, Osaka-shi, Osaka 5410041, JP
Priority Data:
2017-16934704.09.2017JP
Title (EN) METHOD FOR MANUFACTURING BUS BAR ASSEMBLY
(FR) PROCÉDÉ DE FABRICATION D'ENSEMBLE BARRE OMNIBUS
(JA) バスバーアッセンブリの製造方法
Abstract:
(EN) The method for manufacturing a bus bar assembly according to the present invention includes: a step for preparing a first electroconductive metal flat plate; a step for forming a slit in a bus bar assembly formation region of the flat plate; a step for applying a coating that contains an insulating resin such that at least the slit is filled with the insulating resin; a slit for curing the coating and forming an insulating resin layer; and a cutting step for cutting, from the first electroconductive metal flat plate, the insulating resin layer in the slit and bus bar formation portions of the first electroconductive metal flat plate, the bus bar formation portions facing each other across the slit.
(FR) L’invention concerne un procédé de fabrication d'un ensemble barre omnibus comprenant : une étape de préparation d'une première plaque plane métallique électroconductrice ; une étape consistant à former une fente dans une région de formation d'ensemble barre omnibus de la plaque plate ; une étape consistant à appliquer un revêtement qui contient une résine isolante de telle sorte qu'au moins la fente soit remplie avec la résine isolante ; une fente pour durcir le revêtement et former une couche de résine isolante ; et une étape de découpe pour découper, à partir de la première plaque plate métallique électroconductrice, la couche de résine isolante dans les parties de formation de fente et de barre omnibus de la première plaque plate métallique électroconductrice, les parties de formation de barre omnibus se faisant face à travers la fente.
(JA) 本発明に係るバスバーアッセンブリの製造方法は、第1導電性金属平板を用意する工程と、前記平板のバスバーアッセンブリ形成領域にスリットを形成する工程と、少なくとも前記スリットが絶縁性樹脂層で充填されるように絶縁性樹脂を含む塗料を塗装する工程と、前記塗料を硬化させて絶縁性樹脂層を形成する工程と、前記スリット内の絶縁性樹脂層及び前記第1導電性金属平板のうち前記スリットを挟んで対向するバスバー形成部位を前記第1導電性金属平板から切断する切断工程とを含む。
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Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JO, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)