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1. (WO2019044646) COMPOSITION FOR HEAT DISSIPATION MEMBERS, HEAT DISSIPATION MEMBER, ELECTRONIC DEVICE, AND METHOD FOR PRODUCING HEAT DISSIPATION MEMBER
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Pub. No.: WO/2019/044646 International Application No.: PCT/JP2018/031108
Publication Date: 07.03.2019 International Filing Date: 23.08.2018
IPC:
C09K 5/14 (2006.01) ,H01L 23/373 (2006.01) ,H05K 7/20 (2006.01)
C CHEMISTRY; METALLURGY
09
DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
K
MATERIALS FOR APPLICATIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
5
Heat-transfer, heat-exchange or heat-storage materials, e.g. refrigerants; Materials for the production of heat or cold by chemical reactions other than by combustion
08
Materials not undergoing a change of physical state when used
14
Solid materials, e.g. powdery or granular
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23
Details of semiconductor or other solid state devices
34
Arrangements for cooling, heating, ventilating or temperature compensation
36
Selection of materials, or shaping, to facilitate cooling or heating, e.g. heat sinks
373
Cooling facilitated by selection of materials for the device
H ELECTRICITY
05
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
K
PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
7
Constructional details common to different types of electric apparatus
20
Modifications to facilitate cooling, ventilating, or heating
Applicants:
JNC株式会社 JNC CORPORATION [JP/JP]; 東京都千代田区大手町二丁目2番1号 2-1, Otemachi 2-chome, Chiyoda-ku, Tokyo 1008105, JP
Inventors:
氏家 研人 UJIIYE Kento; JP
藤原 武 FUJIWARA Takeshi; JP
國信 隆史 KUNINOBU Takafumi; JP
滝沢 和宏 TAKIZAWA Kazuhiro; JP
Priority Data:
2017-16603830.08.2017JP
Title (EN) COMPOSITION FOR HEAT DISSIPATION MEMBERS, HEAT DISSIPATION MEMBER, ELECTRONIC DEVICE, AND METHOD FOR PRODUCING HEAT DISSIPATION MEMBER
(FR) COMPOSITION POUR ÉLÉMENTS DE DISSIPATION DE CHALEUR, ÉLÉMENT DE DISSIPATION DE CHALEUR, DISPOSITIF ÉLECTRONIQUE ET PROCÉDÉ DE PRODUCTION D'UN ÉLÉMENT DE DISSIPATION DE CHALEUR
(JA) 放熱部材用組成物、放熱部材、電子機器、放熱部材の製造方法
Abstract:
(EN) According to the present invention, a composition which enables the formation of a heat dissipation member that has high heat resistance and high thermal conductivity at the same time is obtained. A composition for heat dissipation members according to the present invention contains: a first inorganic filler (1) that is bonded to one end of a first silane coupling agent (11); a second inorganic filler (2) that is bonded to one end of a second silane coupling agent (12); and a carboxylic acid anhydride (21) that has a functionality of 2 or more.
(FR) La présente invention concerne une composition qui permet la formation d'un élément de dissipation de chaleur qui a une résistance à la chaleur élevée et simultanément une conductivité thermique élevée. Une composition pour des éléments de dissipation de chaleur selon la présente invention contient : une première charge inorganique (1) qui est liée à une extrémité d'un premier agent de couplage au silane (11) ; une seconde charge inorganique (2) qui est liée à une extrémité d'un second agent de couplage au silane (12) ; et un anhydride d'acide carboxylique (21) qui a une fonctionnalité d'au moins 2.
(JA) 高い耐熱性と高い熱伝導率を同時に有する放熱部材を形成可能な組成物を得ること。 本発明の放熱部材用組成物は、第1のシランカップリング剤(11)の一端と結合した第1の無機フィラー(1)、第2のシランカップリング剤(12)の一端と結合した第2の無機フィラー(2)および2官能以上のカルボン酸無水物(21)を含有する、放熱部材用組成物である。
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Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JO, JP, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)