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1. (WO2019044634) ELECTROFORMING MASTER AND METHOD FOR MANUFACTURING ELECTROFORMING MOLD USING SAME
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Pub. No.: WO/2019/044634 International Application No.: PCT/JP2018/031054
Publication Date: 07.03.2019 International Filing Date: 22.08.2018
IPC:
C25D 1/10 (2006.01) ,C25D 1/00 (2006.01) ,C25D 1/20 (2006.01)
C CHEMISTRY; METALLURGY
25
ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
D
PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; JOINING WORKPIECES BY ELECTROLYSIS; APPARATUS THEREFOR
1
Electroforming
10
Moulds; Masks; Masterforms
C CHEMISTRY; METALLURGY
25
ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
D
PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; JOINING WORKPIECES BY ELECTROLYSIS; APPARATUS THEREFOR
1
Electroforming
C CHEMISTRY; METALLURGY
25
ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
D
PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; JOINING WORKPIECES BY ELECTROLYSIS; APPARATUS THEREFOR
1
Electroforming
20
Separation of the formed objects from the electrodes
Applicants:
富士フイルム株式会社 FUJIFILM CORPORATION [JP/JP]; 東京都港区西麻布2丁目26番30号 26-30, Nishiazabu 2-chome, Minato-ku, Tokyo 1068620, JP
Inventors:
梅澤 朋一 UMEZAWA Tomokazu; JP
川崎 昇 KAWASAKI Noboru; JP
清水 隆志 SHIMIZU Takashi; JP
Agent:
中島 順子 NAKASHIMA Junko; JP
米倉 潤造 YONEKURA Junzo; JP
村上 泰規 MURAKAMI Yasunori; JP
Priority Data:
2017-16937404.09.2017JP
Title (EN) ELECTROFORMING MASTER AND METHOD FOR MANUFACTURING ELECTROFORMING MOLD USING SAME
(FR) MATRICE D’ÉLECTRO-FORMAGE ET PROCÉDÉ DE FABRICATION DE MOULE D'ÉLECTRO-FORMAGE LA METTANT EN ŒUVRE
(JA) 電鋳用原盤およびその電鋳用原盤を用いた電鋳モールドの製造方法
Abstract:
(EN) Provided are an electroforming master that does not cause distortion in an electroforming mold, and a method for manufacturing an electroforming mold. In the present invention, an electroforming master having a relief pattern on a surface thereof is configured so as to be provided with a substrate having a flat surface and a Young’s modulus of 50 GPa or greater, and a pattern film which has a Young’s modulus of 10 GPa or less and in which a relief pattern is formed on the surface thereof. The flat surface of the substrate and the surface of the pattern film not provided with the relief pattern are affixed together by an adhesive layer over the entire surface thereof, the adhesion strength between the substrate and the pattern film due to the adhesive layer being 0.01 N/25 mm to 10 N/25 mm, or greater than 10 N/25 mm, and the adhesion strength being reducible to 10 N/25 mm or less by light irradiation or heat treatment of the adhesive layer.
(FR) Cette invention concerne une matrice d'électroformage qui ne provoque pas de distorsion dans un moule d'électroformage, et un procédé de fabrication d'un moule d'électroformage. Dans l'invention, une matrice d'électroformage ayant un motif en relief sur une surface de celle-ci est configurée de façon à être pourvue d'un substrat ayant une surface plane et un module de Young supérieur ou égale à 50 GPa, et un film de motif qui a un module de Young inférieur ou égal à 10 GPa à la surface duquel est formé un motif en relief. La surface plane du substrat et la surface du film de motif non pourvue du motif en relief sont fixées l'une à l'autre par une couche adhésive sur la surface tout entière de celles-ci, la force d'adhérence entre le substrat et le film de motif due à la couche adhésive étant de 0,01 N/25 mm à 10 N/25 mm, ou supérieure à 10 N/25 mm, et la force d'adhérence pouvant être réduite à 10 N/25 mm ou moins par irradiation de lumière ou traitement thermique de la couche adhésive.
(JA) 電鋳モールドに歪を生じさせない電鋳用原盤および電鋳モールドの製造方法を提供する。凹凸パターンを表面に有する電鋳用原盤を、ヤング率が50GPa以上である、平坦面を有する基板と、ヤング率が10GPa以下である、凹凸パターンが表面に形成されたパターンフィルムとを備えたものとする。基板の平坦面とパターンフィルムの凹凸パターンを備えていない面とが、全面に亘って粘着層により貼り合せられており、粘着層による基板とパターンフィルムとの接着力が0.01N/25mm以上、10N/25mm以下である、または、10N/25mm超であり、粘着層への光照射もしくは加熱処理により接着力を10N/25mm以下に低減可能なものとする。
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Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JO, JP, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)