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1. (WO2019044623) ADHESIVE COMPOSITION, ADHESIVE TAPE, AND METHOD FOR PROTECTING SEMICONDUCTOR DEVICE
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Pub. No.: WO/2019/044623 International Application No.: PCT/JP2018/030981
Publication Date: 07.03.2019 International Filing Date: 22.08.2018
IPC:
C09J 201/00 (2006.01) ,C09J 7/38 (2018.01) ,H01L 21/683 (2006.01)
C CHEMISTRY; METALLURGY
09
DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
J
ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
201
Adhesives based on unspecified macromolecular compounds
[IPC code unknown for C09J 7/38]
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21
Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
67
Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components
683
for supporting or gripping
Applicants:
積水化学工業株式会社 SEKISUI CHEMICAL CO., LTD. [JP/JP]; 大阪府大阪市北区西天満2丁目4番4号 4-4, Nishitemma 2-chome, Kita-ku, Osaka-shi, Osaka 5300047, JP
Inventors:
利根川 亨 TONEGAWA, Toru; JP
Agent:
特許業務法人 安富国際特許事務所 YASUTOMI & ASSOCIATES; 大阪府大阪市淀川区宮原3丁目5番36号 5-36, Miyahara 3-chome, Yodogawa-ku, Osaka-shi, Osaka 5320003, JP
Priority Data:
2017-16463029.08.2017JP
Title (EN) ADHESIVE COMPOSITION, ADHESIVE TAPE, AND METHOD FOR PROTECTING SEMICONDUCTOR DEVICE
(FR) COMPOSITION ADHÉSIVE, BANDE ADHÉSIVE, ET PROCÉDÉ DE PROTECTION D'UN DISPOSITIF SEMI-CONDUCTEUR
(JA) 粘着剤組成物、粘着テープ及び半導体デバイスの保護方法
Abstract:
(EN) The purpose of the present invention is to provide: an adhesive composition which has high adhesion strength and which can be separated while adhesive residue is reduced; an adhesive tape having an adhesive layer comprising the adhesive composition; and a method for protecting a semiconductor device using the adhesive composition or the adhesive tape. The present invention pertains to an adhesive composition comprising a crosslinking adhesive polymer that is constituted by an adhesive polymer and a crosslinking agent, the adhesive composition having a gel swelling rate of 500% or higher and a gel fraction of 87% or higher.
(FR) L'invention a pour objet de fournir : une composition adhésive présentant une force d'adhérence élevée et pouvant être séparée en même temps que le résidu adhésif est réduit; une bande adhésive dont une couche adhésive comprend la composition adhésive; et un procédé de protection d'un dispositif semi-conducteur au moyen de la composition adhésive ou de la bande adhésive. L'invention concerne une composition adhésive comprenant un polymère adhésif de réticulation constitué d'un polymère adhésif et d'un agent de réticulation, la composition adhésive présentant un taux de gonflement de gel d'au moins 500% et une fraction de gel d'au moins 87%.
(JA) 本発明は、高い粘着力を有するとともに、糊残りを抑制しつつ剥離することができる粘着剤組成物、該粘着剤組成物からなる粘着剤層を有する粘着テープ及び該粘着剤組成物又は該粘着テープを用いた半導体デバイスの保護方法を提供することを目的とする。 本発明は、粘着ポリマー及び架橋剤から構成される架橋粘着ポリマーを含み、ゲル膨潤率が500%以上であり、ゲル分率が87%以上である、粘着剤組成物である。
Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JO, JP, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)