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1. (WO2019044618) THICK FILM RESISTOR PASTE AND USE OF THICK FILM RESISTOR PASTE IN RESISTOR
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Pub. No.: WO/2019/044618 International Application No.: PCT/JP2018/030963
Publication Date: 07.03.2019 International Filing Date: 22.08.2018
IPC:
H01C 7/00 (2006.01) ,H01B 1/00 (2006.01) ,H01B 1/22 (2006.01)
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
C
RESISTORS
7
Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
B
CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
1
Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
B
CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
1
Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
20
Conductive material dispersed in non-conductive organic material
22
the conductive material comprising metals or alloys
Applicants:
KOA株式会社 KOA CORPORATION [JP/JP]; 長野県伊那市荒井3672番地 3672, Arai, Ina-shi, Nagano 3960025, JP
Inventors:
井口 夏希 IGUCHI Natsuki; JP
井口 裕哉 IGUCHI Yuya; JP
浦野 幸一 URANO Koichi; JP
Agent:
特許業務法人平木国際特許事務所 HIRAKI & ASSOCIATES; 東京都港区愛宕二丁目5-1 愛宕グリーンヒルズMORIタワー32階 Atago Green Hills MORI Tower 32F, 5-1, Atago 2-chome, Minato-ku, Tokyo 1056232, JP
Priority Data:
2017-16710231.08.2017JP
Title (EN) THICK FILM RESISTOR PASTE AND USE OF THICK FILM RESISTOR PASTE IN RESISTOR
(FR) PÂTE POUR RÉSISTANCE À FILM ÉPAIS ET UTILISATION DE PÂTE POUR RÉSISTANCE À FILM ÉPAIS DANS UNE RÉSISTANCE
(JA) 厚膜抵抗体ペースト及び厚膜抵抗体ペーストの抵抗器への使用
Abstract:
(EN) This thick film resistor paste contains: a conductive metal powder including a copper powder and a manganese powder; a glass powder; and an organic vehicle, the thick film resistor paste being characterized in that the glass powder mainly includes an alkaline earth metal.
(FR) Cette pâte pour résistance à film épais contient : une poudre métallique conductrice comprenant une poudre de cuivre et une poudre de manganèse ; une poudre de verre ; et un véhicule organique, la pâte pour résistance à film épais étant caractérisée en ce que la poudre de verre comprend principalement un métal alcalino-terreux.
(JA) 銅粉末およびマンガン粉末を含む導電性金属粉末と、ガラス粉末と、有機ビヒクルとを含有する抵抗体ペーストであって、前記ガラス粉末はアルカリ土類金属を主に含むことを特徴とする厚膜抵抗体ペースト。
front page image
Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JO, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)