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1. (WO2019044530) THINNED PLATE MEMBER PRODUCTION METHOD AND PRODUCTION DEVICE
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Pub. No.: WO/2019/044530 International Application No.: PCT/JP2018/030458
Publication Date: 07.03.2019 International Filing Date: 17.08.2018
IPC:
H01L 21/304 (2006.01) ,B23K 26/53 (2014.01) ,H01L 21/683 (2006.01)
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21
Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
02
Manufacture or treatment of semiconductor devices or of parts thereof
04
the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer, carrier concentration layer
18
the devices having semiconductor bodies comprising elements of the fourth group of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
30
Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20-H01L21/26142
302
to change the physical characteristics of their surfaces, or to change their shape, e.g. etching, polishing, cutting
304
Mechanical treatment, e.g. grinding, polishing, cutting
[IPC code unknown for B23K 26/53]
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21
Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
67
Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components
683
for supporting or gripping
Applicants:
リンテック株式会社 LINTEC CORPORATION [JP/JP]; 東京都板橋区本町23番23号 23-23, Honcho, Itabashi-ku, Tokyo 1730001, JP
Inventors:
泉 直史 IZUMI Naofumi; JP
山下 茂之 YAMASHITA Shigeyuki; JP
Agent:
特許業務法人樹之下知的財産事務所 KINOSHITA & ASSOCIATES; 東京都杉並区荻窪五丁目26番13号 3階 3rd Floor, 26-13, Ogikubo 5-chome, Suginami-ku, Tokyo 1670051, JP
Priority Data:
2017-16977604.09.2017JP
Title (EN) THINNED PLATE MEMBER PRODUCTION METHOD AND PRODUCTION DEVICE
(FR) PROCÉDÉ DE PRODUCTION ET DISPOSITIF DE PRODUCTION D'ÉLÉMENT DE PLAQUE AMINCIE
(JA) 薄型化板状部材の製造方法、及び製造装置
Abstract:
(EN) This thinned plate member production method comprises: a step for attaching a first adhesion surface (AT11) of a first double-sided adhesive sheet (AT1) to a support surface (111) of a first hard support body (110), and attaching a second adhesion surface (AT12) to the entire first surface (WF1) of a plate member (WF); a step for forming a boundary layer (CR) inside the plate member (WF); a step for attachably/detachably fixing a first holding means (130) and the first hard support body (110) so as to locate the first holding means (130) on the opposite side of the plate member (WF) with the first hard support body (110) interposed therebetween; a step for holding the plate member (WF) from a second surface (WF2) side by means of a second holding means (160); and a step of relatively moving the first holding means (130) and the second holding means (160) so as to divide, at the boundary layer (CR) as a boundary, the plate member (WF) into a first thinned plate member having the first surface (WF1) and a second thinned plate member having the second surface (WF2).
(FR) Cette invention concerne un procédé de production d'élément de plaque amincie, comprenant : une étape consistant à fixer une première surface d'adhérence (AT11) d'une première feuille adhésive double face (AT1) à une surface de support (111) d'un premier corps de support dur (110), et à fixer une seconde surface d'adhérence (AT12) à la totalité de la première surface (WF1) d'un élément de plaque (WF) ; une étape consistant à former une couche limite (CR) à l'intérieur de l'élément de plaque (WF) ; une étape consistant à fixer de manière fixe/amovible de premiers moyens de retenue (130) et le premier corps de support dur (110) de façon à positionner les premiers moyens de retenue (130) sur le côté opposé de l'élément de plaque (WF) avec le premier corps de support dur (110) interposé entre ceux-ci ; une consistant à retenir l'élément de plaque (WF) à partir d'un côté de seconde surface (WF2) au moyen de seconds moyens de retenue (160) ; et une étape consistant à déplacer relativement les premiers moyens de retenue (130) et les seconds moyens de retenue (160) de façon à séparer, au niveau de la couche limite (CR) en tant que limite, l'élément de plaque (WF) en un premier élément de plaque amincie ayant la première surface (WF1) et un second élément de plaque amincie ayant la seconde surface (WF2).
(JA) 薄型化板状部材の製造方法は、第1硬質支持体(110)の支持面(111)に第1両面接着シート(AT1)の第1接着面(AT11)を貼付し、板状部材(WF)の第1表面(WF1)全体に第2接着面(AT12)を貼付する工程と、前記板状部材(WF)の内部に境界層(CR)を形成する工程と、第1硬質支持体(110)を挟んで前記板状部材(WF)の反対側に第1保持手段(130)が位置するように、前記第1保持手段(130)と第1硬質支持体(110)とを着脱自在に固定する工程と、第2保持手段(160)で前記板状部材(WF)を第2表面(WF2)側から保持する工程と、前記境界層(CR)を境にして、前記板状部材(WF)を、第1表面(WF1)を有する第1薄型化板状部材、及び第2表面(WF2)を有する第2薄型化板状部材に分割するように、前記第1保持手段(130)と前記第2保持手段(160)とを相対移動させる工程とを備えている。
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Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JO, JP, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)