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1. (WO2019044506) SUBSTRATE PROCESSING SYSTEM, AND SUBSTRATE PROCESSING METHOD
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Pub. No.: WO/2019/044506 International Application No.: PCT/JP2018/030350
Publication Date: 07.03.2019 International Filing Date: 15.08.2018
IPC:
H01L 21/683 (2006.01) ,H01L 21/02 (2006.01) ,H01L 21/301 (2006.01) ,H01L 21/677 (2006.01)
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21
Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
67
Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components
683
for supporting or gripping
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21
Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
02
Manufacture or treatment of semiconductor devices or of parts thereof
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21
Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
02
Manufacture or treatment of semiconductor devices or of parts thereof
04
the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer, carrier concentration layer
18
the devices having semiconductor bodies comprising elements of the fourth group of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
30
Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20-H01L21/26142
301
to subdivide a semiconductor body into separate parts, e.g. making partitions
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21
Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
67
Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components
677
for conveying, e.g. between different work stations
Applicants:
東京エレクトロン株式会社 TOKYO ELECTRON LIMITED [JP/JP]; 東京都港区赤坂五丁目3番1号 3-1, Akasaka 5-chome, Minato-ku, Tokyo 1076325, JP
Inventors:
田村 武 TAMURA, Takeshi; JP
Agent:
伊東 忠重 ITOH, Tadashige; JP
伊東 忠彦 ITOH, Tadahiko; JP
Priority Data:
2017-16360028.08.2017JP
Title (EN) SUBSTRATE PROCESSING SYSTEM, AND SUBSTRATE PROCESSING METHOD
(FR) SYSTÈME DE TRAITEMENT DE SUBSTRAT ET PROCÉDÉ DE TRAITEMENT DE SUBSTRAT
(JA) 基板処理システム、および基板処理方法
Abstract:
(EN) A substrate processing system comprises: an ultraviolet irradiation portion that irradiates ultraviolet rays on a protective tape that protects a substrate; a mounting unit that mounts the substrate on a frame interposed by an adhesive tape that is provided on the reverse side to the protective tape after ultraviolet irradiation using the substrate as a reference; and a peeling part that peels the protective tape from the substrate mounted on the frame with the adhesive tape interposed therebetween. The ultraviolet irradiation portion is provided overlapping the mounting unit in the vertical direction of the mounting unit.
(FR) La présente invention concerne un système de traitement de substrat comprenant : une partie d'irradiation ultraviolette qui irradie des rayons ultraviolets sur une bande de protection qui protège un substrat ; une unité de montage qui monte le substrat sur un cadre interposé par une bande adhésive qui est disposée sur le côté opposé à la bande de protection après une irradiation ultraviolette à l'aide du substrat en tant que référence ; et une partie de pelage qui détache la bande de protection du substrat monté sur le cadre avec la bande adhésive interposée entre celles-ci. La partie d'irradiation ultraviolette est disposée de manière à chevaucher l'unité de montage dans la direction verticale de l'unité de montage.
(JA) 基板を保護する保護テープに紫外線を照射する紫外線照射部と、前記基板を基準として紫外線照射後の前記保護テープとは反対側に設けられる粘着テープを介して、前記基板をフレームに装着するマウント部と、前記粘着テープを介して前記フレームに装着した前記基板から、前記保護テープを剥離する剥離部とを備え、前記紫外線照射部は、前記マウント部の鉛直方向上方に前記マウント部と重ねて設けられる、基板処理システム。
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Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JO, JP, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)