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1. (WO2019044464) SOLID-STATE IMAGING DEVICE AND METHOD FOR CONTROLLING SOLID-STATE IMAGING DEVICE
Latest bibliographic data on file with the International Bureau    Submit observation

Pub. No.: WO/2019/044464 International Application No.: PCT/JP2018/030106
Publication Date: 07.03.2019 International Filing Date: 10.08.2018
IPC:
H04N 5/359 (2011.01) ,H01L 27/146 (2006.01) ,H04N 5/369 (2011.01)
H ELECTRICITY
04
ELECTRIC COMMUNICATION TECHNIQUE
N
PICTORIAL COMMUNICATION, e.g. TELEVISION
5
Details of television systems
30
Transforming light or analogous information into electric information
335
using solid-state image sensors [SSIS]
357
Noise processing, e.g. detecting, correcting, reducing or removing noise
359
applied to excess charges produced by the exposure, e.g. smear, blooming, ghost image, crosstalk or leakage between pixels
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
27
Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
14
including semiconductor components sensitive to infra-red radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
144
Devices controlled by radiation
146
Imager structures
H ELECTRICITY
04
ELECTRIC COMMUNICATION TECHNIQUE
N
PICTORIAL COMMUNICATION, e.g. TELEVISION
5
Details of television systems
30
Transforming light or analogous information into electric information
335
using solid-state image sensors [SSIS]
369
SSIS architecture; Circuitry associated therewith
Applicants:
ソニーセミコンダクタソリューションズ株式会社 SONY SEMICONDUCTOR SOLUTIONS CORPORATION [JP/JP]; 神奈川県厚木市旭町四丁目14番1号 4-14-1, Asahicho, Atsugi-shi, Kanagawa 2430014, JP
Inventors:
渡部 泰一郎 WATANABE, Taiichiro; JP
山口 哲司 YAMAGUCHI, Tetsuji; JP
佐藤 友亮 SATO, Yusuke; JP
古閑 史彦 KOGA, Fumihiko; JP
Agent:
特許業務法人つばさ国際特許事務所 TSUBASA PATENT PROFESSIONAL CORPORATION; 東京都新宿区新宿1丁目15番9号さわだビル3階 3F, Sawada Building, 15-9, Shinjuku 1-chome, Shinjuku-ku, Tokyo 1600022, JP
Priority Data:
2017-16785231.08.2017JP
Title (EN) SOLID-STATE IMAGING DEVICE AND METHOD FOR CONTROLLING SOLID-STATE IMAGING DEVICE
(FR) DISPOSITIF D'IMAGERIE À SEMI-CONDUCTEURS ET PROCÉDÉ DE COMMANDE D'UN DISPOSITIF D'IMAGERIE À SEMI-CONDUCTEURS
(JA) 固体撮像装置および固体撮像装置の制御方法
Abstract:
(EN) [Solution] A solid-state imaging device according to an embodiment of the present disclosure is provided with: a first electrode comprising a plurality of independent electrodes; a second electrode arranged opposite to the first electrode; a photoelectric conversion layer provided between the first electrode and the second electrode; and a voltage applying unit for applying different voltages to at least one of the first electrode and the second electrode during a charge storage period and during a non-charge storage period.
(FR) À cet effet, selon un mode de réalisation la présente invention concerne un dispositif d'imagerie à semi-conducteurs qui comprend : une première électrode comprenant une pluralité d'électrodes indépendantes ; une seconde électrode agencée à l'opposé de la première électrode ; une couche de conversion photoélectrique disposée entre la première électrode et la seconde électrode ; et une unité d'application de tension pour appliquer différentes tensions à au moins une parmi la première électrode et la seconde électrode pendant une période de stockage de charge et pendant une période de stockage de non-charge.
(JA) 【解決手段】本開示の一実施形態の固体撮像装置は、互いに独立する複数の電極からなる第1電極と、第1電極と対向配置された第2電極と、第1電極と第2電極との間に設けられた光電変換層と、第1電極および第2電極の少なくとも一方に対して、電荷蓄積期間および非電荷蓄積期間において、互いに異なる電圧を印加する電圧印加部とを備える。
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Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JO, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)