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1. (WO2019044463) PROCESSING LIQUID, KIT, AND METHOD FOR CLEANING SUBSTRATE
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Pub. No.: WO/2019/044463 International Application No.: PCT/JP2018/030101
Publication Date: 07.03.2019 International Filing Date: 10.08.2018
IPC:
H01L 21/304 (2006.01) ,C11D 7/32 (2006.01) ,C11D 7/50 (2006.01) ,C11D 17/08 (2006.01)
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21
Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
02
Manufacture or treatment of semiconductor devices or of parts thereof
04
the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer, carrier concentration layer
18
the devices having semiconductor bodies comprising elements of the fourth group of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
30
Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20-H01L21/26142
302
to change the physical characteristics of their surfaces, or to change their shape, e.g. etching, polishing, cutting
304
Mechanical treatment, e.g. grinding, polishing, cutting
C CHEMISTRY; METALLURGY
11
ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
D
DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
7
Compositions of detergents based essentially on non-surface-active compounds
22
Organic compounds
32
containing nitrogen
C CHEMISTRY; METALLURGY
11
ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
D
DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
7
Compositions of detergents based essentially on non-surface-active compounds
50
Solvents
C CHEMISTRY; METALLURGY
11
ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
D
DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
17
Detergent materials or soaps characterised by their shape or physical properties
08
Liquid soap; capsuled
Applicants:
富士フイルム株式会社 FUJIFILM CORPORATION [JP/JP]; 東京都港区西麻布2丁目26番30号 26-30, Nishiazabu 2-chome, Minato-ku, Tokyo 1068620, JP
Inventors:
高橋 智威 TAKAHASHI Tomonori; JP
上村 哲也 KAMIMURA Tetsuya; JP
Agent:
中島 順子 NAKASHIMA Junko; JP
米倉 潤造 YONEKURA Junzo; JP
村上 泰規 MURAKAMI Yasunori; JP
Priority Data:
2017-16773031.08.2017JP
2018-05593323.03.2018JP
Title (EN) PROCESSING LIQUID, KIT, AND METHOD FOR CLEANING SUBSTRATE
(FR) LIQUIDE DE TRAITEMENT, KIT ET PROCÉDÉ DE NETTOYAGE DE SUBSTRAT
(JA) 処理液、キット、基板の洗浄方法
Abstract:
(EN) Provided is a processing liquid for semiconductor devices, which exhibits excellent anti-corrosion properties, residue removal properties and defect suppressing properties for an object to be processed. Also provided are: a kit; and a method for cleaning a substrate, which uses the above-described processing liquid. A processing liquid for semiconductor devices, which contains water, an organic solvent, and two or more kinds of nitrogen-containing aromatic heterocyclic compounds.
(FR) L’invention concerne un liquide de traitement pour des dispositifs à semi-conducteurs, offrant d’excellentes propriétés d’anticorrosion, d’élimination des résidus et de suppression des défauts vis-à-vis d’un objet à traiter. L’invention concerne également : un kit ; et un procédé de nettoyage d’un substrat faisant appel au liquide de traitement décrit ci-dessus. Un liquide de traitement pour des dispositifs à semi-conducteurs contient de l’eau, un solvant organique et au moins deux types de composés hétérocycliques aromatiques renfermant de l’azote.
(JA) 半導体デバイス用の処理液であって、処理対象物に対する防食性、残渣物除去性、及び欠陥抑制性に優れる処理液を提供する。また、キット、及び上記処理液を用いた基板の洗浄方法を提供する。半導体デバイス用の処理液であって、水と、有機溶剤と、2種以上の含窒素芳香族複素環化合物と、を含む、処理液。
Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JO, JP, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)