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1. (WO2019044199) SUBSTRATE-PROCESSING DEVICE AND SUBSTRATE-PROCESSING METHOD
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Pub. No.: WO/2019/044199 International Application No.: PCT/JP2018/026237
Publication Date: 07.03.2019 International Filing Date: 11.07.2018
IPC:
H01L 21/304 (2006.01)
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21
Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
02
Manufacture or treatment of semiconductor devices or of parts thereof
04
the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer, carrier concentration layer
18
the devices having semiconductor bodies comprising elements of the fourth group of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
30
Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20-H01L21/26142
302
to change the physical characteristics of their surfaces, or to change their shape, e.g. etching, polishing, cutting
304
Mechanical treatment, e.g. grinding, polishing, cutting
Applicants:
株式会社SCREENホールディングス SCREEN HOLDINGS CO., LTD. [JP/JP]; 京都府京都市上京区堀川通寺之内上る4丁目天神北町1番地の1 Tenjinkita-machi 1-1, Teranouchi-agaru 4-chome, Horikawa-dori, Kamigyo-ku, Kyoto-shi, Kyoto 6028585, JP
Inventors:
藤原 直澄 FUJIWARA, Naozumi; JP
Agent:
松阪 正弘 MATSUSAKA, Masahiro; JP
田中 勉 TANAKA, Tsutomu; JP
井田 正道 IDA, Masamichi; JP
Priority Data:
2017-16736031.08.2017JP
2017-16736131.08.2017JP
Title (EN) SUBSTRATE-PROCESSING DEVICE AND SUBSTRATE-PROCESSING METHOD
(FR) DISPOSITIF DE TRAITEMENT DE SUBSTRAT ET PROCÉDÉ DE TRAITEMENT DE SUBSTRAT
(JA) 基板処理装置および基板処理方法
Abstract:
(EN) A stripping solution feeding unit (6) of a substrate-processing device (1) feeds a stripping solution onto the peripheral edge region (93) of the upper surface (91) of a rotating substrate (9), and thereby strips the portion of a coating film on the substrate (9) that is on the peripheral edge region (93). A cup part (4) is disposed around a substrate holder (31), and receives the stripping solution scattering around from the rotating substrate (9). The stripping solution feeding unit (6) is provided with a mixing unit (61) and a fourth nozzle (64), which serves as a stripping solution discharge unit. The mixing unit (61) mixes a water-soluble organic solvent and a water-based solvent and produces the stripping solution. The fourth nozzle (64) discharges the stripping solution delivered from the mixing unit (61) towards the substrate (9). It is thereby possible to satisfactorily remove the peripheral edge part of the coating film formed on the substrate (9) and to inhibit splashback of the stripping solution from the cup part (4).
(FR) Une unité d'alimentation en solution de décapage (6) d'un dispositif de traitement de substrat (1) selon l'invention amène une solution de décapage sur la région de bord périphérique (93) de la surface supérieure (91) d'un substrat (9) en rotation, et décape ainsi la partie d'un film de revêtement, sur le substrat (9), qui se trouve sur la région de bord périphérique (93). Une partie coupelle (4) est disposée autour d'un porte-substrat (31), et reçoit la solution de décapage se répandant autour du substrat (9) en rotation. L'unité d'alimentation en solution de décapage (6) est pourvue d'une unité de mélange (61) et d'une quatrième buse (64), qui sert d'unité d'éjection de solution de décapage. L'unité de mélange (61) mélange un solvant organique soluble dans l'eau et un solvant à base d'eau et produit la solution de décapage. La quatrième buse (64) éjecte vers le substrat (9) la solution de décapage délivrée par l'unité de mélange (61). Il est ainsi possible d'enlever de manière satisfaisante la partie de bord périphérique du film de revêtement formé sur le substrat (9), et d'empêcher des éclaboussures de la solution de décapage provenant de la partie coupelle (4).
(JA) 基板処理装置(1)の剥離液供給部(6)は、回転中の基板(9)の上面(91)の周縁領域(93)に剥離液を供給することにより、基板(9)上の塗布膜のうち周縁領域(93)上の部位を基板(9)から剥離させる。カップ部(4)は、基板保持部(31)の周囲に配置され、回転中の基板(9)から周囲に飛散する剥離液を受ける。剥離液供給部(6)は、混合部(61)と、剥離液吐出部である第4ノズル(64)とを備える。混合部(61)は、水溶性有機溶剤と水性溶媒とを混合して剥離液を生成する。第4ノズル(64)は、混合部(61)から送出された剥離液を基板(9)に向けて吐出する。これにより、基板(9)上に形成された塗布膜の周縁部を好適に除去することができるとともに、カップ部(4)からの剥離液の跳ね返りを抑制することができる。
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Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JO, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)