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1. (WO2019044172) IMAGING DEVICE AND METHOD FOR PRODUCING IMAGING DEVICE
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Pub. No.: WO/2019/044172 International Application No.: PCT/JP2018/025629
Publication Date: 07.03.2019 International Filing Date: 06.07.2018
IPC:
H04N 5/225 (2006.01) ,G02B 5/22 (2006.01) ,G03B 11/00 (2006.01) ,G03B 17/02 (2006.01) ,H01L 27/146 (2006.01) ,H04N 5/369 (2011.01)
H ELECTRICITY
04
ELECTRIC COMMUNICATION TECHNIQUE
N
PICTORIAL COMMUNICATION, e.g. TELEVISION
5
Details of television systems
222
Studio circuitry; Studio devices; Studio equipment
225
Television cameras
G PHYSICS
02
OPTICS
B
OPTICAL ELEMENTS, SYSTEMS, OR APPARATUS
5
Optical elements other than lenses
20
Filters
22
Absorbing filters
G PHYSICS
03
PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
B
APPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
11
Filters or other obturators specially adapted for photographic purposes
G PHYSICS
03
PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
B
APPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
17
Details of cameras or camera bodies; Accessories therefor
02
Bodies
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
27
Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
14
including semiconductor components sensitive to infra-red radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
144
Devices controlled by radiation
146
Imager structures
H ELECTRICITY
04
ELECTRIC COMMUNICATION TECHNIQUE
N
PICTORIAL COMMUNICATION, e.g. TELEVISION
5
Details of television systems
30
Transforming light or analogous information into electric information
335
using solid-state image sensors [SSIS]
369
SSIS architecture; Circuitry associated therewith
Applicants:
ソニーセミコンダクタソリューションズ株式会社 SONY SEMICONDUCTOR SOLUTIONS CORPORATION [JP/JP]; 神奈川県厚木市旭町四丁目14番1号 4-14-1 Asahi-cho, Atsugi-shi, Kanagawa 2430014, JP
Inventors:
永井 信之 NAGAI, Nobuyuki; JP
柳川 周作 YANAGAWA, Shusaku; JP
Agent:
丸島 敏一 MARUSHIMA, Toshikazu; JP
Priority Data:
2017-16424029.08.2017JP
Title (EN) IMAGING DEVICE AND METHOD FOR PRODUCING IMAGING DEVICE
(FR) DISPOSITIF D'IMAGERIE ET PROCÉDÉ PERMETTANT DE PRODUIRE UN DISPOSITIF D'IMAGERIE
(JA) 撮像装置、および、撮像装置の製造方法
Abstract:
(EN) An imaging device which is provided with a transparent substrate, and wherein warping of a substrate is prevented, while blocking stray light. An imaging device according to the present invention is provided with a sensor chip, a transparent substrate, a light-blocking wall and an optical filter. With respect to this imaging device, a solid-state imaging element is arranged in a light reception region of the sensor chip. With respect to this imaging device, the transparent substrate is mounted on the outer peripheral portion of the sensor chip. With respect to this imaging device, the light-blocking wall blocks light that transmits through the transparent substrate and is subsequently incident on the light reception region. The optical filter is provided with the light-blocking wall.
(FR) La présente invention concerne un dispositif d'imagerie qui est pourvu d'un substrat transparent et dans lequel un gauchissement d'un substrat est empêché, tout en bloquant une lumière parasite. Un dispositif d'imagerie selon la présente invention est pourvu d'une puce de capteur, d'un substrat transparent, d'une paroi de blocage de lumière et d'un filtre optique. Par rapport à ce dispositif d'imagerie, un élément d'imagerie à semi-conducteurs est disposé dans une région de réception de lumière de la puce de capteur. Par rapport à ce dispositif d'imagerie, le substrat transparent est monté sur la partie périphérique externe de la puce de capteur. Par rapport à ce dispositif d'imagerie, la paroi de blocage de lumière bloque la lumière qui est transmise à travers le substrat transparent et est, par la suite, incidente sur la région de réception de lumière. Le filtre optique est pourvu de la paroi de blocage de lumière.
(JA) 透明な基板が設けられた撮像装置において、迷光を遮光しつつ、基板の反りを防止する。 撮像装置は、センサチップ、透明基板、遮光壁および光学フィルタを具備する。この撮像装置において、センサチップの受光領域に固体撮像素子が設けられる。また、撮像装置において、センサチップの外縁部に透明基板が搭載される。また、撮像装置において、遮光壁は、透明基板を透過して前受光領域に入射する光を遮光する。光学フィルタには遮光壁が形成される。
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Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JO, JP, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)