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1. (WO2019044154) POLY(PHENYLENE ETHER) RESIN COMPOSITION, AND PREPREG, METAL-CLAD LAMINATE, AND WIRING BOARD EACH OBTAINED USING SAME
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Pub. No.: WO/2019/044154 International Application No.: PCT/JP2018/024819
Publication Date: 07.03.2019 International Filing Date: 29.06.2018
IPC:
C08L 71/12 (2006.01) ,B32B 15/08 (2006.01) ,C08K 5/5399 (2006.01) ,H05K 1/03 (2006.01)
C CHEMISTRY; METALLURGY
08
ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
L
COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
71
Compositions of polyethers obtained by reactions forming an ether link in the main chain; Compositions of derivatives of such polymers
08
Polyethers derived from hydroxy compounds or from their metallic derivatives
10
from phenols
12
Polyphenylene oxides
B PERFORMING OPERATIONS; TRANSPORTING
32
LAYERED PRODUCTS
B
LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
15
Layered products essentially comprising metal
04
comprising metal as the main or only constituent of a layer, next to another layer of a specific substance
08
of synthetic resin
C CHEMISTRY; METALLURGY
08
ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
K
USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES AS COMPOUNDING INGREDIENTS
5
Use of organic ingredients
49
Phosphorus-containing compounds
5399
Phosphorus bound to nitrogen
H ELECTRICITY
05
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
K
PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
1
Printed circuits
02
Details
03
Use of materials for the substrate
Applicants:
パナソニックIPマネジメント株式会社 PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD. [JP/JP]; 大阪府大阪市中央区城見2丁目1番61号 1-61, Shiromi 2-chome, Chuo-ku, Osaka-shi, Osaka 5406207, JP
Inventors:
鈴木 文人 SUZUKI, Fumito; --
梅原 大明 UMEHARA, Hiroaki; --
安本 洵 YASUMOTO, Jun; --
井上 博晴 INOUE, Hiroharu; --
Agent:
小谷 悦司 KOTANI, Etsuji; JP
小谷 昌崇 KOTANI, Masataka; JP
宇佐美 綾 USAMI, Aya; JP
Priority Data:
2017-16646231.08.2017JP
Title (EN) POLY(PHENYLENE ETHER) RESIN COMPOSITION, AND PREPREG, METAL-CLAD LAMINATE, AND WIRING BOARD EACH OBTAINED USING SAME
(FR) COMPOSITION DE RÉSINE DE POLY(PHÉNYLÈNE-ÉTHER) ET PRÉIMPRÉGNÉ, STRATIFIÉ PLAQUÉ DE MÉTAL ET CARTE DE CÂBLAGE, CHACUN OBTENU À L'AIDE DE CELLE-CI
(JA) ポリフェニレンエーテル樹脂組成物、並びに、それを用いたプリプレグ、金属張積層板及び配線基板
Abstract:
(EN) The present invention relates to a poly(phenylene ether) resin composition that comprises (A) a modified poly(phenylene ether) compound, which includes a terminal modified with a substituent having an unsaturated carbon-carbon double bond, (B) a crosslinking hardener having an unsaturated carbon-carbon double bond in the molecule, and (C) a flame retardant, characterized in that the flame retardant (C) comprises a modified cyclic phenoxyphosphazene compound represented by formula (I).
(FR) La présente invention concerne une composition de résine de poly(phénylène-éther) qui comprend (A) un composé de type poly(phénylène-éther) modifié, qui comprend une extrémité modifiée par un substituant présentant une double liaison carbone-carbone insaturée, (B) un durcisseur de réticulation présentant une double liaison carbone-carbone insaturée dans la molécule et (C) un retardateur de flamme, caractérisée en ce que le retardateur de flamme (C) comprend un composé de type phénoxyphosphazène cyclique modifié représenté par la formule (I).
(JA) 本発明は、(A)炭素-炭素不飽和二重結合を有する置換基により末端変性された変性ポリフェニレンエーテル化合物と、(B)炭素-炭素不飽和二重結合を分子中に有する架橋型硬化剤と、(C)難燃剤とを含有するポリフェニレンエーテル樹脂組成物であって、前記(C)難燃剤は、式(I)で示される変性環状フェノキシホスファゼン化合物を少なくとも含有することを特徴とする、ポリフェニレンエーテル樹脂組成物に関する。
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Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JO, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)