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1. (WO2019044133) MOLDING COMPOSITION FOR SiC AND GaN ELEMENT SEALING, AND ELECTRONIC COMPONENT DEVICE
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Pub. No.: WO/2019/044133 International Application No.: PCT/JP2018/023651
Publication Date: 07.03.2019 International Filing Date: 21.06.2018
IPC:
C08L 79/00 (2006.01) ,C08K 7/22 (2006.01) ,C08L 61/00 (2006.01) ,C08L 63/00 (2006.01) ,H01L 23/12 (2006.01) ,H01L 23/29 (2006.01) ,H01L 23/31 (2006.01)
C CHEMISTRY; METALLURGY
08
ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
L
COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
79
Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen, or carbon only, not provided for in groups C08L61/-C08L77/259
C CHEMISTRY; METALLURGY
08
ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
K
USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES AS COMPOUNDING INGREDIENTS
7
Use of ingredients characterised by shape
22
Expanded, porous or hollow particles
C CHEMISTRY; METALLURGY
08
ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
L
COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
61
Compositions of condensation polymers of aldehydes or ketones; Compositions of derivatives of such polymers
C CHEMISTRY; METALLURGY
08
ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
L
COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
63
Compositions of epoxy resins; Compositions of derivatives of epoxy resins
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23
Details of semiconductor or other solid state devices
12
Mountings, e.g. non-detachable insulating substrates
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23
Details of semiconductor or other solid state devices
28
Encapsulation, e.g. encapsulating layers, coatings
29
characterised by the material
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23
Details of semiconductor or other solid state devices
28
Encapsulation, e.g. encapsulating layers, coatings
31
characterised by the arrangement
Applicants:
京セラ株式会社 KYOCERA CORPORATION [JP/JP]; 京都府京都市伏見区竹田鳥羽殿町6番地 6, Takeda Tobadono-cho, Fushimi-ku, Kyoto-shi, Kyoto 6128501, JP
Inventors:
渡辺 尚紀 WATANABE, Naoki; JP
藏 勇人 KURA, Isato; JP
Agent:
平澤 賢一 HIRASAWA, Kenichi; JP
有永 俊 ARINAGA, Shun; JP
早川 美和 HAYAKAWA, Miwa; JP
Priority Data:
2017-16351528.08.2017JP
2017-24294319.12.2017JP
2017-25013226.12.2017JP
Title (EN) MOLDING COMPOSITION FOR SiC AND GaN ELEMENT SEALING, AND ELECTRONIC COMPONENT DEVICE
(FR) COMPOSITION DE MOULAGE POUR SCELLEMENT D'ÉLÉMENT DE SiC ET DE GaN, ET DISPOSITIF DE TYPE COMPOSANT ÉLECTRONIQUE
(JA) SiC及びGaN素子封止用成形材料組成物、電子部品装置
Abstract:
(EN) A molding composition for SiC and GaN element sealing containing (A) a maleimide resin, (B) a curing agent, (D) a curing accelerator, and (E) a filler, the (E) filler containing (e-1) a hollow structured filler.
(FR) L'invention concerne une composition de moulage pour scellement d'élément de SiC et de GaN qui contient (A) une résine de maléimide, (B) un agent de durcissement, (D) un accélérateur de durcissement, et (E) une charge, la charge (E) contenant (e-1) une charge structurée creuse.
(JA) (A)マレイミド樹脂、(B)硬化剤、(D)硬化促進剤及び(E)充填材を含有し、 前記(E)充填材は(e-1)中空構造充填材を含有するSiC及びGaN素子封止用成形材料組成物。
Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JO, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)