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1. (WO2019043959) FLUX, SOLDER PASTE, AND METHOD FOR PRODUCING ELECTRONIC CIRCUIT BOARD
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Pub. No.: WO/2019/043959 International Application No.: PCT/JP2017/035800
Publication Date: 07.03.2019 International Filing Date: 02.10.2017
IPC:
B23K 35/363 (2006.01) ,H05K 3/34 (2006.01)
B PERFORMING OPERATIONS; TRANSPORTING
23
MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
K
SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
35
Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
22
characterised by the composition or nature of the material
36
Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
362
Selection of compositions of fluxes
363
for soldering or brazing
H ELECTRICITY
05
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
K
PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
3
Apparatus or processes for manufacturing printed circuits
30
Assembling printed circuits with electric components, e.g. with resistor
32
electrically connecting electric components or wires to printed circuits
34
by soldering
Applicants:
株式会社弘輝 KOKI COMPANY LIMITED [JP/JP]; 東京都足立区千住旭町32番1 32-1, Senju-asahi-cho, Adachi-ku, Tokyo 1200026, JP
Inventors:
古澤 光康 FURUSAWA, Mitsuyasu; JP
Agent:
藤本 昇 FUJIMOTO, Noboru; JP
Priority Data:
2017-16355828.08.2017JP
Title (EN) FLUX, SOLDER PASTE, AND METHOD FOR PRODUCING ELECTRONIC CIRCUIT BOARD
(FR) FLUX, PÂTE À SOUDER ET PROCÉDÉ DE PRODUCTION DE CARTE DE CIRCUIT IMPRIMÉS ÉLECTRONIQUE
(JA) フラックス、ソルダペースト及び電子回路基板の製造方法
Abstract:
(EN) The flux according to the present invention contains at least one liquid solvent that is a liquid at normal temperature and has at least one hydroxy group, and contains at least two solid solvents that are solid at normal temperature and have at least one hydroxy group. The content of each solid solvent is less than 40 mass% with reference to the total content of the liquid solvent and the solid solvent.
(FR) Le flux selon la présente invention contient au moins un solvant liquide qui est un liquide à température normale et qui possède au moins un groupe hydroxy, et contient au moins deux solvants solides qui sont solides à température normale et qui possèdent au moins un groupe hydroxy. La teneur en chaque solvant solide est inférieure à 40 % en masse par rapport à la teneur totale en solvant liquide et en solvant solide.
(JA) フラックスは、ヒドロキシ基を1つ以上有すると共に、常温で液体の液体溶剤を少なくとも1種、及び、ヒドロキシ基を1つ以上有すると共に、常温で固体の固体溶剤を少なくとも2種含み、各固体溶剤の含有量が、前記液体溶剤及び前記固体溶剤の合計含有量に対して、40質量%未満である。
Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JO, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)