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1. (WO2019043933) FLEXIBLE SUBSTRATE AND OPTICAL MODULE
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Pub. No.: WO/2019/043933 International Application No.: PCT/JP2017/031705
Publication Date: 07.03.2019 International Filing Date: 04.09.2017
IPC:
H05K 1/02 (2006.01) ,H05K 3/28 (2006.01)
H ELECTRICITY
05
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
K
PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
1
Printed circuits
02
Details
H ELECTRICITY
05
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
K
PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
3
Apparatus or processes for manufacturing printed circuits
22
Secondary treatment of printed circuits
28
Applying non-metallic protective coatings
Applicants:
三菱電機株式会社 MITSUBISHI ELECTRIC CORPORATION [JP/JP]; 東京都千代田区丸の内二丁目7番3号 7-3, Marunouchi 2-chome, Chiyoda-ku, Tokyo 1008310, JP
Inventors:
畑 端佳 HATA Tadayoshi; JP
Agent:
吉竹 英俊 YOSHITAKE Hidetoshi; JP
有田 貴弘 ARITA Takahiro; JP
Priority Data:
Title (EN) FLEXIBLE SUBSTRATE AND OPTICAL MODULE
(FR) SUBSTRAT SOUPLE ET MODULE OPTIQUE
(JA) フレキシブル基板および光モジュール
Abstract:
(EN) A wiring end part 50e of an FPC pattern 50 is joined to a package Pk1. A cover lay Cv1 covers a portion other than the wiring end part 50e of the FPC pattern 50. A cover lay end C1e of the cover lay Cv1 corresponds to the boundary between the cover lay Cv1 and the wiring end part 50e. The shape of the cover lay end C1e is wave shaped. Of the wiring end part 50e of the FPC pattern 50, solder Sd1 is provided to a surface 5a of the portion adjacent to a recess V1 of the cover lay end C1e.
(FR) Selon l'invention, une partie d'extrémité de câblage 50e d'un motif de FPC 50 est jointe à un emballage Pk1. Une couche de couverture Cv1 recouvre une partie autre que la partie d'extrémité de câblage 50e du motif de FPC 50. Une extrémité de couche de couverture C1e de la couche de couverture Cv1 correspond à la limite entre la couche de couverture Cv1 et la partie d'extrémité de câblage 50e. La forme de l'extrémité de couche de couverture C1e est en forme d'onde. À partir de la partie d'extrémité de câblage 50e du motif FPC 50, la soudure Sd1 est appliquée à une surface 5a de la partie adjacente à un évidement V1 de l'extrémité de couche de couverture C1e.
(JA) FPCパターン50の配線端部50eは、パッケージPk1に接合される。カバーレイCv1は、FPCパターン50のうち、配線端部50e以外の部分を覆っている。カバーレイCv1のカバーレイ端C1eは、当該カバーレイCv1と配線端部50eとの境界に相当する。カバーレイ端C1eの形状は、波状である。FPCパターン50の配線端部50eのうち、カバーレイ端C1eのくぼみV1に隣接する部分の表面5aには、はんだSd1が設けられる。
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Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JO, JP, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)