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1. (WO2019043844) OPTICAL COMPONENT AND TRANSPARENT SEALING MEMBER
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Pub. No.: WO/2019/043844 International Application No.: PCT/JP2017/031211
Publication Date: 07.03.2019 International Filing Date: 30.08.2017
IPC:
H01L 33/54 (2010.01) ,H01L 33/56 (2010.01)
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
33
Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
48
characterised by the semiconductor body packages
52
Encapsulations
54
having a particular shape
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
33
Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
48
characterised by the semiconductor body packages
52
Encapsulations
56
Materials, e.g. epoxy or silicone resin
Applicants:
日本碍子株式会社 NGK INSULATORS, LTD. [JP/JP]; 愛知県名古屋市瑞穂区須田町2番56号 2-56, Suda-cho, Mizuho-ku, Nagoya-shi, Aichi 4678530, JP
Inventors:
菊池芳郎 KIKUCHI Yoshio; JP
岩井真 IWAI Makoto; JP
Agent:
千葉剛宏 CHIBA Yoshihiro; JP
宮寺利幸 MIYADERA Toshiyuki; JP
千馬隆之 SENBA Takayuki; JP
大内秀治 OUCHI Hideharu; JP
仲宗根康晴 NAKASONE Yasuharu; JP
坂井志郎 SAKAI Shiro; JP
関口亨祐 SEKIGUCHI Kosuke; JP
山野明 YAMANO Akira; JP
Priority Data:
Title (EN) OPTICAL COMPONENT AND TRANSPARENT SEALING MEMBER
(FR) COMPOSANT OPTIQUE ET ÉLÉMENT D'ÉTANCHÉITÉ TRANSPARENT
(JA) 光学部品及び透明封止部材
Abstract:
(EN) The present invention relates to an optical component and a transparent sealing member. An optical component (10) has: at least one optical element (12); and a package (14) that houses therein the optical element (12). The package (14) has: a mounting board (16) on which the optical element (12) is mounted; a transparent sealing member (20) bonded on the mounting board (16); a recessed section (26) surrounding the optical element (12) mounted on the mounting board (16); and a refractive index matching agent (28) applied to the inside of the recessed section (26). The package (14) has at least one groove (30) in communication with the outside from the recessed section (26).
(FR) La présente invention concerne un composant optique et un élément d'étanchéité transparent. Un composant optique (10) comprend : au moins un élément optique (12) ; et un boîtier (14) qui loge intérieurement l'élément optique (12). Le boîtier (14) comprend : un panneau de montage (16) sur qui est monté l'élément optique (12) ; un élément d'étanchéité transparent (20) collé sur le panneau de montage (16) ; une section évidée (26) entourant l'élément optique (12) monté sur le panneau de montage (16) ; et un agent d'adaptation d'indice de réfraction (28) appliqué dans la section évidée (26). Le boîtier (14) présente au moins une rainure (30) en communication avec l'extérieur depuis la section évidée (26).
(JA) 本発明は、光学部品及び透明封止部材に関する。光学部品(10)は、少なくとも1つの光学素子(12)と、光学素子(12)が収容されるパッケージ(14)とを有する。パッケージ(14)は、光学素子(12)が実装される実装基板(16)と、実装基板(16)上に接合される透明封止部材(20)と、実装基板(16)に実装された光学素子(12)を囲む凹部(26)と、凹部(26)内に充填された屈折率整合剤(28)とを有する。パッケージ(14)は、凹部(26)から外部に連通する少なくとも1つの溝(30)を有する。
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Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JO, JP, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)