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1. (WO2019043843) CURED EPOXY RESIN MATERIAL, EPOXY RESIN COMPOSITION, MOLDED ARTICLE, AND COMPOSITE MATERIAL
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Pub. No.: WO/2019/043843 International Application No.: PCT/JP2017/031209
Publication Date: 07.03.2019 International Filing Date: 30.08.2017
IPC:
C08G 59/20 (2006.01) ,C08G 59/40 (2006.01) ,C08J 5/00 (2006.01)
C CHEMISTRY; METALLURGY
08
ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
G
MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
59
Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by reaction of epoxy polycondensates with monofunctional low-molecular-weight compounds; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
18
Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
20
characterised by the epoxy compounds used
C CHEMISTRY; METALLURGY
08
ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
G
MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
59
Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by reaction of epoxy polycondensates with monofunctional low-molecular-weight compounds; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
18
Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
40
characterised by the curing agents used
C CHEMISTRY; METALLURGY
08
ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
J
WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H142
5
Manufacture of articles or shaped materials containing macromolecular substances
Applicants:
日立化成株式会社 HITACHI CHEMICAL COMPANY, LTD. [JP/JP]; 東京都千代田区丸の内一丁目9番2号 9-2, Marunouchi 1-chome, Chiyoda-ku, Tokyo 1006606, JP
Inventors:
福田 和真 FUKUDA, Kazumasa; JP
竹澤 由高 TAKEZAWA, Yoshitaka; JP
丸山 直樹 MARUYAMA, Naoki; JP
吉田 優香 YOSHIDA, Yuka; JP
東内 智子 HIGASHIUCHI, Tomoko; JP
Agent:
特許業務法人太陽国際特許事務所 TAIYO, NAKAJIMA & KATO; 東京都新宿区新宿4丁目3番17号 3-17, Shinjuku 4-chome, Shinjuku-ku, Tokyo 1600022, JP
Priority Data:
Title (EN) CURED EPOXY RESIN MATERIAL, EPOXY RESIN COMPOSITION, MOLDED ARTICLE, AND COMPOSITE MATERIAL
(FR) OBJET DURCI DE RÉSINE ÉPOXY, COMPOSITION DE RÉSINE ÉPOXY, CORPS MOULÉ, ET MATÉRIAU COMPOSITE
(JA) エポキシ樹脂硬化物、エポキシ樹脂組成物、成形体及び複合材料
Abstract:
(EN) The following are provided: a cured epoxy resin material that has a smectic structure and is a cured material from an epoxy compound having a mesogen structure and a curing agent having a flexible skeleton or a molecular chain with a molecular weight of at least 100; a cured epoxy resin material that does not have a smectic structure and is a cured material from an epoxy compound having a mesogen structure and a curing agent having a flexible skeleton or a molecular chain with a molecular weight of at least 100; an epoxy resin composition containing an epoxy compound having a mesogen structure and a curing agent having a molecular chain with a molecular weight of at least 100; and a resin composition containing an epoxy compound having a mesogen structure and a curing agent having a flexible skeleton in the molecule.
(FR) L'invention concerne : un objet durci de résine époxy à base d'un composé époxy ayant une structure mésogène, et d'un agent de durcissement ayant une chaîne moléculaire de masse moléculaire supérieure ou égale à 100 ou un squelette souple, qui possède une structure smectique ; un objet durci de résine époxy à base d'un composé époxy ayant une structure mésogène, et d'un agent de durcissement ayant une chaîne moléculaire de masse moléculaire supérieure ou égale à 100 ou un squelette souple, qui ne possède pas de structure smectique ; et une composition de résine époxy qui contient un composé époxy ayant une structure mésogène, et un agent de durcissement ayant une chaîne moléculaire de masse moléculaire supérieure ou égale à 100, ou une composition de résine qui contient un composé époxy ayant une structure mésogène, et un agent de durcissement ayant un squelette souple dans chaque molécule.
(JA) メソゲン構造を有するエポキシ化合物と、分子量が100以上の分子鎖又は柔軟性骨格を有する硬化剤との硬化物であり、スメクチック構造を有するエポキシ樹脂硬化物、メソゲン構造を有するエポキシ化合物と、分子量が100以上の分子鎖又は柔軟性骨格を有する硬化剤との硬化物であり、スメクチック構造を有しないエポキシ樹脂硬化物、メソゲン構造を有するエポキシ化合物と、分子量が100以上の分子鎖を有する硬化剤と、を含むエポキシ樹脂組成物、又はメソゲン構造を有するエポキシ化合物と、分子中に柔軟性骨格を有する硬化剤と、を含む樹脂組成物。
Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JO, JP, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)