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1. (WO2019043819) SLURRY AND POLISHING METHOD
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Pub. No.: WO/2019/043819 International Application No.: PCT/JP2017/031087
Publication Date: 07.03.2019 International Filing Date: 30.08.2017
IPC:
H01L 21/304 (2006.01) ,B24B 37/00 (2012.01) ,C09K 3/14 (2006.01)
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21
Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
02
Manufacture or treatment of semiconductor devices or of parts thereof
04
the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer, carrier concentration layer
18
the devices having semiconductor bodies comprising elements of the fourth group of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
30
Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20-H01L21/26142
302
to change the physical characteristics of their surfaces, or to change their shape, e.g. etching, polishing, cutting
304
Mechanical treatment, e.g. grinding, polishing, cutting
B PERFORMING OPERATIONS; TRANSPORTING
24
GRINDING; POLISHING
B
MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
37
Lapping machines or devices; Accessories
C CHEMISTRY; METALLURGY
09
DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
K
MATERIALS FOR APPLICATIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
3
Materials not provided for elsewhere
14
Anti-slip materials; Abrasives
Applicants:
日立化成株式会社 HITACHI CHEMICAL COMPANY, LTD. [JP/JP]; 東京都千代田区丸の内一丁目9番2号 9-2, Marunouchi 1-chome, Chiyoda-ku, Tokyo 1006606, JP
Inventors:
松本 貴彬 MATSUMOTO Takaaki; JP
岩野 友洋 IWANO Tomohiro; JP
長谷川 智康 HASEGAWA Tomoyasu; JP
Agent:
長谷川 芳樹 HASEGAWA Yoshiki; JP
清水 義憲 SHIMIZU Yoshinori; JP
平野 裕之 HIRANO Hiroyuki; JP
Priority Data:
Title (EN) SLURRY AND POLISHING METHOD
(FR) BOUILLIE, ET PROCÉDÉ DE POLISSAGE
(JA) スラリ及び研磨方法
Abstract:
(EN) This slurry contains abrasive grains, a liquid medium, and at least one type selected from the group consisting of compounds represented by expression (1) and salts thereof. The abrasive grains include first particles and second particles contacting said first particles. The first particles contain cerium oxide, and the second particles contain a hydroxide of a tetravalent metal element. [In expression (1), R represents a hydroxyl group or a monovalent organic group.]
(FR) L'invention concerne une bouillie qui comprend des grains abrasifs, un milieu liquide, et au moins un élément choisi dans un groupe constitué d'un composé représenté par la formule (1) et d'un sel de celui-ci. Les grains abrasifs contiennent des premières particules, et des secondes particules en contact avec ces premières particules. Les premières particules comprennent un oxyde de cérium, et les secondes particules comprennent un hydroxyde d'élément métallique tétravalent. [Dans la formule (1), R représente un groupe hydroxyle ou un groupe organique monovalent.]
(JA) 砥粒と、液状媒体と、下記式(1)で表される化合物及びその塩からなる群より選択される少なくとも一種と、を含有し、砥粒が、第1の粒子と、当該第1の粒子に接触した第2の粒子と、を含み、第1の粒子がセリウム酸化物を含有し、第2の粒子が4価金属元素の水酸化物を含有する、スラリ。[式(1)中、Rは、水酸基又は1価の有機基を示す。]
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Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JO, JP, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)