Some content of this application is unavailable at the moment.
If this situation persist, please contact us atFeedback&Contact
1. (WO2019043796) POLISHING DEVICE AND POLISHING METHOD
Latest bibliographic data on file with the International Bureau    Submit observation

Pub. No.: WO/2019/043796 International Application No.: PCT/JP2017/030992
Publication Date: 07.03.2019 International Filing Date: 29.08.2017
IPC:
B24B 21/12 (2006.01) ,B24B 9/00 (2006.01) ,B24B 21/00 (2006.01) ,H01L 21/304 (2006.01)
B PERFORMING OPERATIONS; TRANSPORTING
24
GRINDING; POLISHING
B
MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
21
Machines or devices using grinding or polishing belts; Accessories therefor
04
for grinding plane surfaces
12
involving a contact wheel or roller pressing the belt against the work
B PERFORMING OPERATIONS; TRANSPORTING
24
GRINDING; POLISHING
B
MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
9
Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor
B PERFORMING OPERATIONS; TRANSPORTING
24
GRINDING; POLISHING
B
MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
21
Machines or devices using grinding or polishing belts; Accessories therefor
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21
Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
02
Manufacture or treatment of semiconductor devices or of parts thereof
04
the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer, carrier concentration layer
18
the devices having semiconductor bodies comprising elements of the fourth group of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
30
Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20-H01L21/26142
302
to change the physical characteristics of their surfaces, or to change their shape, e.g. etching, polishing, cutting
304
Mechanical treatment, e.g. grinding, polishing, cutting
Applicants:
株式会社 荏原製作所 EBARA CORPORATION [JP/JP]; 東京都大田区羽田旭町11番1号 11-1, Haneda Asahi-cho, Ohta-ku, Tokyo 1448510, JP
Inventors:
柏木 誠 KASHIWAGI, Makoto; JP
保科 真穂 HOSHINA, Manao; JP
Agent:
廣澤 哲也 HIROSAWA, Tetsuya; JP
渡邉 勇 WATANABE, Isamu; JP
Priority Data:
Title (EN) POLISHING DEVICE AND POLISHING METHOD
(FR) DISPOSITIF ET PROCÉDÉ DE POLISSAGE
(JA) 研磨装置および研磨方法
Abstract:
(EN) The present invention pertains to a polishing device that uses a polishing tool to polish an edge part of a wafer. The polishing device is provided with a substrate holding part (1) that holds and rotates a substrate (W), and at least one polishing unit that uses a belt-like polishing tool (5) to polish an edge part of the substrate (W). The polishing unit is provided with: a disk head (12) having an outer circumferential surface that supports the rear surface of the polishing tool (5); a pressing band (14) that presses the polishing tool (5) against the outer circumferential surface of the disk head (12); and a plurality of band guide rollers (15A to 15D) that support the pressing band (14).
(FR) La présente invention concerne un dispositif de polissage qui utilise un outil de polissage pour polir une partie de bord d'une plaquette. Le dispositif de polissage est pourvu d'une partie de maintien de substrat (1) qui maintient et fait tourner un substrat (W), et d'au moins une unité de polissage qui utilise un outil de polissage de type courroie (5) pour polir une partie de bord du substrat (W). L'unité de polissage comprend: une tête de disque (12) présentant une surface circonférentielle externe qui soutient la surface arrière de l'outil de polissage (5); une bande de compression (14) qui comprime l'outil de polissage (5) contre la surface circonférentielle externe de la tête de disque (12); et une pluralité de rouleaux de guidage de bande (15A à 15D) qui soutiennent la bande de compression (14).
(JA) 本発明は、ウェハのエッジ部を研磨具を用いて研磨する研磨装置に関する。研磨装置は、基板(W)を保持して回転させる基板保持部(1)と、基板(W)のエッジ部を帯状の研磨具(5)を用いて研磨する少なくとも1つの研磨ユニットとを備える。研磨ユニットは、研磨具(5)の裏面を支持する外周面を有する円盤ヘッド(12)と、研磨具(5)を円盤ヘッド(12)の外周面に押し付ける押し付けバンド(14)と、押し付けバンド(14)を支持する複数のバンドガイドローラー(15A~15D)とを備える。
front page image
Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JO, JP, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)