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1. (WO2019043778) CURABLE COMPOSITION, CURABLE PASTE MATERIAL, CURABLE SHEET MATERIAL, CURABLE MODELING MATERIAL, CURING METHOD, AND CURED PRODUCT
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Pub. No.: WO/2019/043778 International Application No.: PCT/JP2017/030905
Publication Date: 07.03.2019 International Filing Date: 29.08.2017
IPC:
C08G 59/68 (2006.01) ,C08G 65/18 (2006.01)
C CHEMISTRY; METALLURGY
08
ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
G
MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
59
Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by reaction of epoxy polycondensates with monofunctional low-molecular-weight compounds; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
18
Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
68
characterised by the catalysts used
C CHEMISTRY; METALLURGY
08
ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
G
MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
65
Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule
02
from cyclic ethers by opening of the heterocyclic ring
04
from cyclic ethers only
06
Cyclic ethers having no atoms other than carbon and hydrogen outside the ring
16
Cyclic ethers having four or more ring atoms
18
Oxetanes
Applicants:
三菱重工業株式会社 MITSUBISHI HEAVY INDUSTRIES, LTD. [JP/JP]; 東京都港区港南二丁目16番5号 16-5, Konan 2-chome, Minato-ku, Tokyo 1088215, JP
Inventors:
林 宣也 HAYASHI Noriya; JP
榊原 敏克 SAKAKIBARA Toshikatsu; JP
小林 祐輔 KOBAYASHI Yusuke; JP
木村 龍也 KIMURA Tatsuya; JP
Agent:
松沼 泰史 MATSUNUMA Yasushi; JP
伊藤 英輔 ITO Eisuke; JP
橋本 宏之 HASHIMOTO Hiroyuki; JP
古都 智 FURUICHI Satoshi; JP
鎌田 康一郎 KAMATA Koichiro; JP
長谷川 太一 HASEGAWA Taichi; JP
Priority Data:
Title (EN) CURABLE COMPOSITION, CURABLE PASTE MATERIAL, CURABLE SHEET MATERIAL, CURABLE MODELING MATERIAL, CURING METHOD, AND CURED PRODUCT
(FR) COMPOSITION DURCISSABLE, MATÉRIAU DE PÂTE DURCISSABLE, MATÉRIAU DE FEUILLE DURCISSABLE, MATÉRIAU DURCISSABLE DE FABRICATION DE MOULE, PROCÉDÉ DE DURCISSEMENT, ET OBJET DURCI
(JA) 硬化性組成物、硬化性ペースト材、硬化性シート材、硬化性型取り材、硬化方法および硬化物
Abstract:
(EN) This curable composition includes a cationic polymerizable compound, a thermal polymerization initiator, and a storage stabilizer. The cationic polymerizable compound includes at least two selected from the group consisting of glycidyl ether compounds, alicyclic epoxy compounds, and oxetane compounds. The thermal polymerization initiator content is 0.3-3 parts by mass per 100 parts by mass of the cationic polymerizable compound, and chain curing is possible through the thermal energy generated by the polymerization reaction of the cationic polymerizable compound.
(FR) La composition durcissable de l'invention contient un composé polymérisable par voie cationique, un initiateur de polymérisation thermique et un agent de stabilisation de conservation. Ledit composé polymérisable par voie cationique contient au moins deux composés choisis dans un groupe constitué d'un composé éther glycidylique, d'un composé époxy alicyclique et d'un composé oxétane. La teneur en initiateur de polymérisation thermique est comprise entre 0,3 et 3 parties en masse pour 100 parties en masse dudit composé polymérisable par voie cationique. Un durcissement par réaction en chaîne est possible sous l'effet d'une énergie thermique générée par réaction de polymérisation dudit composé polymérisable par voie cationique.
(JA) 本発明の硬化性組成物は、カチオン重合性化合物と、熱重合開始剤と、保存安定剤とを含み、前記カチオン重合性化合物が、グリシジルエーテル化合物、脂環式エポキシ化合物、およびオキセタン化合物からなる群から選ばれる少なくとも2種を含み、前記熱重合開始剤の含有量が、前記カチオン重合性化合物100質量部に対して0.3~3質量部であり、前記カチオン重合性化合物の重合反応により発生した熱エネルギーにより連鎖硬化可能である。
Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JO, JP, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)