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1. (WO2019043355) METHODS AND APPARATUS FOR MANUFACTURING A PLURALITY OF ELECTRONIC CIRCUITS
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Pub. No.: WO/2019/043355 International Application No.: PCT/GB2018/052327
Publication Date: 07.03.2019 International Filing Date: 16.08.2018
IPC:
H01L 21/67 (2006.01) ,H01L 21/60 (2006.01) ,H01L 21/68 (2006.01)
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21
Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
67
Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21
Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
02
Manufacture or treatment of semiconductor devices or of parts thereof
04
the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer, carrier concentration layer
50
Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the groups H01L21/06-H01L21/326162
60
Attaching leads or other conductive members, to be used for carrying current to or from the device in operation
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21
Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
67
Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components
68
for positioning, orientation or alignment
Applicants:
PRAGMATIC PRINTING LTD. [GB/GB]; National Centre for Printable Electronics Thomas Wright Way NETPark Sedgefield TS21 3FG, GB
Inventors:
PRICE, Richard; GB
DEVENPORT, Stephen; GB
COBB, Brian; GB
Agent:
HGF LIMITED; 1 City Walk Leeds West Yorkshire LS11 9DX, GB
Priority Data:
1713882.730.08.2017GB
Title (EN) METHODS AND APPARATUS FOR MANUFACTURING A PLURALITY OF ELECTRONIC CIRCUITS
(FR) PROCÉDÉS ET APPAREIL DE FABRICATION D'UNE PLURALITÉ DE CIRCUITS ÉLECTRONIQUES
Abstract:
(EN) The present invention relates to a method and apparatus for manufacturing a plurality of electronic circuits (7), each electronic circuit (7) comprising a respective flexible first portion (5), comprising a respective group of contact pads (contacts) (35), and a respective flexible electronic component (a flexible integrated circuit, IC) (3), comprising a respective group of terminals (37) and mounted on the respective group of contact pads (35) with each terminal (37) in electrical contact with a respective contact pad (35), the method comprising: • providing (e.g. manufacturing) a flexible first structure (flexible substrate) (15), e.g. a flexible web, comprising the plurality of flexible first portions (5); • providing (e.g. manufacturing) a second structure comprising the plurality of flexible ICs (3) and a common support (11) arranged to support the plurality of flexible ICs (3); • dispensing an adhesive (9) onto the flexible first structure (15) and/ or onto the flexible ICs (3); • transferring said flexible ICs (3) from the common support (11) onto the flexible first structure (15) such that each group of terminals (37) is mounted on (brought into electrical contact with) a respective group of contact pads (35) to form an electronic circuit (7), • providing a heated surface (23a) and an opposing surface (23b, 117) (a pair of nip rollers (17a, 17b) or a roller (17a) and a planar surface (117)) together having a gap (19) therebetween, • transferring the flexible first structure (15), comprising the electronic circuits (7), between the heated surface (23a) and the opposing surface (23b, 117) such that the adhesive (9) is cured by application of heat and pressure from the heated surface (23a) and the opposing surface (23b, 117), thereby adhering the IC (3) onto the respective first portion (5). A silicone paper layer (26) may be located between the electronic circuits (7) and the heated surface (23a) to protect the heated surface (23a) from fouling with excess adhesive.
(FR) La présente invention concerne un procédé et un appareil de fabrication d'une pluralité de circuits électroniques (7), chaque circuit électronique (7) comprenant une première partie souple respective (5), comprenant un groupe respectif de plots de contact (contacts) (35), et un composant électronique souple respectif (un circuit intégré souple, CI (3), comprenant un groupe respectif de bornes (37) et monté sur le groupe respectif de plots de contact (35), chaque borne (37) étant en contact électrique avec un plot de contact respectif (35), le procédé comprenant les étapes consistant à : fournir (par exemple, fabriquer) une première structure souple (substrat souple) (15), par exemple un ruban souple, comprenant la pluralité de premières parties (5); fournir (par exemple, fabriquer) une seconde structure comprenant la pluralité de CI souples (3) et un support commun (11) conçu pour supporter la pluralité de CI souples (3); distribuer un adhésif (9) sur la première structure souple (15) et/ou sur les CI souples (3); transférer lesdits CI souples (3) depuis le support commun (11) sur la première structure souple (15) de sorte que chaque groupe de bornes (37) soit monté sur (mis en contact électrique avec) un groupe respectif de plots de contact (35) pour former un circuit électronique (7), fournir une surface chauffée (23a) et une surface opposée (23b, 117) (une paire de rouleaux pinceurs (17a, 17b) ou un rouleau (17a) et une surface plane (117)) ensemble ayant un espace (19) entre elles, transférer la première structure souple (15), comprenant les circuits électroniques (7), entre la surface chauffée (23a) et la surface opposée (23b, 117) de sorte que l'adhésif (9) soit durci par application de chaleur et de pression à partir de la surface chauffée (23a) et de la surface opposée (23b, 117), ce qui permet de faire adhérer le CI (3) sur la première partie respective (5). Une couche de papier en silicone (26) peut être disposée entre les circuits électroniques (7) et la surface chauffée (23a) pour protéger la surface chauffée (23a) de l'encrassement avec un excès d'adhésif.
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Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JO, JP, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: English (EN)
Filing Language: English (EN)