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1. (WO2019043354) INTEGRATED CIRCUIT HANDLING PROCESS AND APPARATUS
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Pub. No.: WO/2019/043354 International Application No.: PCT/GB2018/052326
Publication Date: 07.03.2019 International Filing Date: 16.08.2018
IPC:
H01L 21/683 (2006.01)
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21
Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
67
Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components
683
for supporting or gripping
Applicants:
PRAGMATIC PRINTING LTD. [GB/GB]; National Centre for Printable Electronics Thomas Wright Way NETPark Sedgefield TS21 3FG, GB
Inventors:
PRICE, Richard; GB
DEVENPORT, Stephen; GB
COBB, Brian Hardy; GB
Agent:
HGF LIMITED; 1 City Walk Leeds West Yorkshire LS11 9DX, GB
Priority Data:
1713883.530.08.2017GB
Title (EN) INTEGRATED CIRCUIT HANDLING PROCESS AND APPARATUS
(FR) PROCÉDÉ ET APPAREIL DE MANIPULATION DE CIRCUIT INTÉGRÉ
Abstract:
(EN) The invention relates to a process and apparatus for selectively changing adhesion strength between a flexible substrate and a carrier at specific locations in order to facilitate shipping and subsequent removal of the flexible substrate from the carrier, the process comprising the steps of: providing a flexible substrate comprising a plurality of integrated circuits thereon; providing a carrier for the flexible substrate and adhering the flexible substrate to the carrier by creating an interface between the flexible substrate and the carrier; changing the adhesion force between the flexible substrate and the carrier at selected locations by non-uniform treatment of the interface between the flexible substrate and the carrier with an electromagnetic radiation source (e.g. a laser, flashlamp, high powered LED, an infrared radiation source or the like) so as to decrease or increase the adhesion force between a portion of the flexible substrate and the carrier at the selected location.
(FR) L'invention concerne un procédé et un appareil pour changer sélectivement la force d'adhérence entre un substrat flexible et un support à des emplacements spécifiques afin de faciliter l'expédition et le retrait ultérieur du substrat flexible à partir du support, le procédé comprenant les étapes consistant à : fournir un substrat flexible comprenant une pluralité de circuits intégrés sur celui-ci ; fournir un support pour le substrat flexible et faire adhérer le substrat flexible au support en créant une interface entre le substrat flexible et le support ; la modification de la force d'adhérence entre le substrat flexible et le support à des emplacements sélectionnés par un traitement non uniforme de l'interface entre le substrat flexible et le support avec une source de rayonnement électromagnétique (par exemple, un laser, une lampe flash, une DEL à haute puissance, une source de rayonnement infrarouge ou similaire) de façon à diminuer ou à augmenter la force d'adhérence entre une partie du substrat flexible et le support à l'emplacement sélectionné.
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Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JO, JP, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: English (EN)
Filing Language: English (EN)