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1. (WO2019043329) METHOD FOR DISASSEMBLING A PHOTOVOLTAIC MODULE AND ASSOCIATED INSTALLATION
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Pub. No.: WO/2019/043329 International Application No.: PCT/FR2018/052113
Publication Date: 07.03.2019 International Filing Date: 28.08.2018
IPC:
H01L 31/048 (2014.01) ,B32B 43/00 (2006.01) ,B29C 63/00 (2006.01) ,H01L 31/18 (2006.01) ,B29B 17/02 (2006.01)
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
31
Semiconductor devices sensitive to infra-red radiation, light, electromagnetic radiation of shorter wavelength, or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
04
adapted as conversion devices
042
including a panel or array of photoelectric cells, e.g. solar cells
048
encapsulated or with housing
B PERFORMING OPERATIONS; TRANSPORTING
32
LAYERED PRODUCTS
B
LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
43
Operations specially adapted for layered products and not otherwise provided for, e.g. repairing; Apparatus therefor
B PERFORMING OPERATIONS; TRANSPORTING
29
WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
C
SHAPING OR JOINING OF PLASTICS; SHAPING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL; AFTER- TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
63
Lining or sheathing, i.e. applying preformed layers or sheathings of plastics; Apparatus therefor
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
31
Semiconductor devices sensitive to infra-red radiation, light, electromagnetic radiation of shorter wavelength, or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
18
Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
B PERFORMING OPERATIONS; TRANSPORTING
29
WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
B
PREPARATION OR PRETREATMENT OF THE MATERIAL TO BE SHAPED; MAKING GRANULES OR PREFORMS; RECOVERY OF PLASTICS OR OTHER CONSTITUENTS OF WASTE MATERIAL CONTAINING PLASTICS
17
Recovery of plastics or other constituents of waste material containing plastics
02
Separating plastics from other materials
Applicants:
COMMISSARIAT À L'ÉNERGIE ATOMIQUE ET AUX ÉNERGIES ALTERNATIVES [FR/FR]; Bâtiment le Ponant D 25 rue Leblanc 75015 PARIS, FR
Inventors:
COUSTIER, Fabrice; FR
MESSAOUDI, Paul; FR
SERASSET, Marion; FR
VELET, Nicolas; FR
Agent:
GRIS, Sébastien; FR
GUERIN, Jean-Philippe; FR
LE GOALLER, Christophe; FR
Priority Data:
175801030.08.2017FR
Title (EN) METHOD FOR DISASSEMBLING A PHOTOVOLTAIC MODULE AND ASSOCIATED INSTALLATION
(FR) PROCEDE DE DESASSEMBLAGE D'UN MODULE PHOTOVOLTAÏQUE ET INSTALLATION ASSOCIEE
Abstract:
(EN) The method makes it possible to disassemble a photovoltaic module (1) including a first protective element (2), a second protective element (3), photovoltaic cells (4) that are located between the first protective element (2) and the second protective element (3), an envelope (5) in which the photovoltaic cells (4) are encapsulated. The envelope (5) links the first protective element (2) to the second protective element (3) and includes: o a first portion (7) that is located between the photovoltaic cells (4) and the first protective element (2); and o a second portion (8) that is located between the photovoltaic cells (4) and the second protective element (3). The disassembly method includes a step (E2) of separating the photovoltaic cells (4) with respect to the first protective element (2) comprising a step (E2-1) of cutting the first portion (7) of the envelope (5) by means of an abrasive wire (12).
(FR) Le procédé permet de désassembler un module photovoltaïque (1 ) comportant un premier élément de protection (2), un deuxième élément de protection (3), des cellules photovoltaïques (4) situées entre le premier élément de protection (2) et le deuxième élément de protection (3), une enveloppe (5) d'encapsulation des cellules photovoltaïques (4). L'enveloppe (5) relie le premier élément de protection (2) au deuxième élément de protection (3) et comporte : o une première partie (7) située entre les cellules photovoltaïques (4) et le premier élément de protection (2), et o une deuxième partie (8) située entre les cellules photovoltaïques (4) et le deuxième élément de protection (3). Le procédé de désassemblage comporte une étape de séparation (E2) des cellules photovoltaïques (4) par rapport au premier élément de protection (2) comprenant une étape de découpe (E2-1 ) de la première partie (7) de l'enveloppe (5) par un fil abrasif (12).
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Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JO, JP, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: French (FR)
Filing Language: French (FR)