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1. (WO2019043185) KIT FOR MAKING A FLOOR COVERING
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Pub. No.: WO/2019/043185 International Application No.: PCT/EP2018/073523
Publication Date: 07.03.2019 International Filing Date: 31.08.2018
IPC:
E04F 15/10 (2006.01) ,E04F 15/08 (2006.01) ,E04F 15/04 (2006.01)
E FIXED CONSTRUCTIONS
04
BUILDING
F
FINISHING WORK ON BUILDINGS, e.g. STAIRS, FLOORS
15
Flooring
02
Flooring or floor layers composed of a number of similar elements
10
of other materials, e.g. fibrous or chipped materials, organic plastics, magnesite, hardboard
E FIXED CONSTRUCTIONS
04
BUILDING
F
FINISHING WORK ON BUILDINGS, e.g. STAIRS, FLOORS
15
Flooring
02
Flooring or floor layers composed of a number of similar elements
08
only of stone or stone-like material, e.g. concrete; of glass
E FIXED CONSTRUCTIONS
04
BUILDING
F
FINISHING WORK ON BUILDINGS, e.g. STAIRS, FLOORS
15
Flooring
02
Flooring or floor layers composed of a number of similar elements
04
only of wood, e.g. with wooden connecting members
Applicants:
TARKETT GDL S.A. [LU/LU]; Z.I. Eselborn - Lentzweiler 2, op der Sang 9779 LENTZWEILER, LU
Inventors:
PERES, Richard; LU
Agent:
BLOT, Philippe; FR
DOMENEGO, Bertrand; FR
COLOMBIE, Damien; FR
NEYRET, Daniel; FR
HOLTZ, Beatrice; FR
HABASQUE, Etienne; FR
Priority Data:
17306139.101.09.2017EP
Title (EN) KIT FOR MAKING A FLOOR COVERING
(FR) KIT POUR CONSTITUER UN REVÊTEMENT DE SOL
Abstract:
(EN) Kit (1) adapted to be assembled on a floor (3) for covering the floor, the kit comprising at least one part (15) adapted for forming a floor covering layer (17) having a thickness F1 in a direction (V) intended to be perpendicular to the floor when the kit is assembled. The kit comprises a plurality of substrate elements (13) adapted for being located under the floor covering layer at least when the kit is assembled. The thickness F1 is larger than or equal to 1 mm, each of the substrate elements has a same thickness E1, and the substrate elements comprise a material having a Young's modulus higher than 300 MPa. The kit further comprises a connecting system (11) adapted for connecting the substrate elements one to another, and integral with the substrate elements.
(FR) L'invention concerne un kit (1) conçu pour être assemblé sur un sol (3) afin de recouvrir le sol, le kit comprenant au moins une partie (15) conçue pour former une couche de revêtement (17) de sol ayant une épaisseur F1 dans une direction (V) destinée à être perpendiculaire au sol lorsque le kit est assemblé. Le kit comprend une pluralité d'éléments de substrat (13) conçus pour être situés sous la couche de revêtement de sol au moins lorsque le kit est assemblé. L'épaisseur F1 est supérieure ou égale à 1 mm, chacun des éléments de substrat a une même épaisseur E1, et les éléments de substrat comprennent un matériau ayant un module de Young supérieur à 300 MPa. Le kit comprend en outre un système de liaison (11) conçu pour relier les éléments de substrat les uns aux autres et intégré aux éléments de substrat.
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Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JO, JP, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: English (EN)
Filing Language: English (EN)