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1. (WO2019042564) SURFACE-MOUNTABLE OPTOELECTRONIC DEVICE AND METHOD FOR PRODUCING A SURFACE-MOUNTABLE OPTOELECTRONIC DEVICE
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Pub. No.: WO/2019/042564 International Application No.: PCT/EP2017/071997
Publication Date: 07.03.2019 International Filing Date: 01.09.2017
IPC:
H01L 33/48 (2010.01) ,H01L 33/50 (2010.01) ,H01L 33/62 (2010.01) ,H01L 33/46 (2010.01) ,H01L 25/075 (2006.01)
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
33
Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
48
characterised by the semiconductor body packages
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
33
Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
48
characterised by the semiconductor body packages
50
Wavelength conversion elements
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
33
Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
48
characterised by the semiconductor body packages
62
Arrangements for conducting electric current to or from the semiconductor body, e.g. leadframe, wire-bond or solder balls
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
33
Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
44
characterised by the coatings, e.g. passivation layer or anti-reflective coating
46
Reflective coating, e.g. dielectric Bragg reflector
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
25
Assemblies consisting of a plurality of individual semiconductor or other solid state devices
03
all the devices being of a type provided for in the same subgroup of groups H01L27/-H01L51/128
04
the devices not having separate containers
075
the devices being of a type provided for in group H01L33/78
Applicants:
OSRAM OPTO SEMICONDUCTORS GMBH [DE/DE]; Leibnizstr. 4 93055 Regensburg, DE
Inventors:
CHUAH, Teng Hai; MY
KOAY, Seong Tak; MY
CHONG, Chui Wai; MY
NG, Adelene; MY
Agent:
EPPING HERMANN FISCHER PATENTANWALTSGESELLSCHAFT MBH; Schloßschmidstr. 5 80639 München, DE
Priority Data:
Title (EN) SURFACE-MOUNTABLE OPTOELECTRONIC DEVICE AND METHOD FOR PRODUCING A SURFACE-MOUNTABLE OPTOELECTRONIC DEVICE
(FR) DISPOSITIF OPTOÉLECTRONIQUE MONTABLE EN SURFACE ET PROCÉDÉ DE PRODUCTION D'UN DISPOSITIF OPTOÉLECTRONIQUE MONTABLE EN SURFACE
Abstract:
(EN) A surface-mountable optoelectronic device (100) comprises two or more semiconductor chips (1A, 1B), wherein each semiconductor chip is designed to emit radiation during its intended operation. The optoelectronic device further comprises a contiguous first housing body (2). Each semiconductor chip comprises a contact side (11) with contact elements (15) for electrically contacting the semiconductor chip. In an unmounted configuration of the optoelectronic device the contact elements of the semiconductor chips form a part of a bottom side (101) of the optoelectronic device and are freely accessible at the bottom side of the optoelectronic device. The semiconductor chips are molded into the first housing body such that the first housing body surrounds the semiconductor chips form-fittingly in a lateral direction. A side surface (102) of the optoelectronic device is at least partially formed by the first housing body.
(FR) L'invention concerne un dispositif optoélectronique montable en surface (100) comprenant deux ou plusieurs puces semi-conductrices (1A, 1B), chaque puce semi-conductrice étant conçue pour émettre un rayonnement pendant son fonctionnement souhaité. Le dispositif optoélectronique comprend en outre un premier corps de boîtier (2) contigu. Chaque puce semi-conductrice comprend un côté de contact (11) avec des éléments de contact (15) pour mettre en contact électrique la puce semi-conductrice. Dans une configuration non montée du dispositif optoélectronique, les éléments de contact des puces semi-conductrices forment une partie d'un côté inférieur (101) du dispositif optoélectronique et sont librement accessibles sur le côté inférieur du dispositif optoélectronique. Les puces semi-conductrices sont moulées dans le premier corps de boîtier de telle sorte que le premier corps de boîtier enveloppe les puces semi-conductrices de manière ajustée dans une direction latérale. Une surface latérale (102) du dispositif optoélectronique est au moins partiellement formée par le premier corps de boîtier.
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Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JO, JP, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: English (EN)
Filing Language: English (EN)