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1. (WO2019042446) ELECTRICAL DEVICE AND ELECTRICAL APPARATUS
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Pub. No.: WO/2019/042446 International Application No.: PCT/CN2018/103750
Publication Date: 07.03.2019 International Filing Date: 03.09.2018
IPC:
H01L 23/367 (2006.01) ,H01L 23/473 (2006.01) ,H01L 23/48 (2006.01) ,H01L 25/16 (2006.01) ,H01L 25/07 (2006.01)
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23
Details of semiconductor or other solid state devices
34
Arrangements for cooling, heating, ventilating or temperature compensation
36
Selection of materials, or shaping, to facilitate cooling or heating, e.g. heat sinks
367
Cooling facilitated by shape of device
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23
Details of semiconductor or other solid state devices
34
Arrangements for cooling, heating, ventilating or temperature compensation
46
involving the transfer of heat by flowing fluids
473
by flowing liquids
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23
Details of semiconductor or other solid state devices
48
Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads or terminal arrangements
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
25
Assemblies consisting of a plurality of individual semiconductor or other solid state devices
16
the devices being of types provided for in two or more different main groups of groups H01L27/-H01L51/139
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
25
Assemblies consisting of a plurality of individual semiconductor or other solid state devices
03
all the devices being of a type provided for in the same subgroup of groups H01L27/-H01L51/128
04
the devices not having separate containers
07
the devices being of a type provided for in group H01L29/78
Applicants:
清华大学 TSINGHUA UNIVERSITY [CN/CN]; 中国北京市 海淀区清华园 Qing Hua Yuan, Haidian District Beijing 100084, CN
清华四川能源互联网研究院 SICHUAN ENERGY INTERNET RESEARCH INSTITUTE, TSINGHUA UNIVERSITY [CN/CN]; CN
Inventors:
曾嵘 ZENG, Rong; CN
陈政宇 CHEN, Zhengyu; CN
刘佳鹏 LIU, Jiapeng; CN
周文鹏 ZHOU, Wenpeng; CN
赵彪 ZHAO, Biao; CN
余占清 YU, Zhanqing; CN
Agent:
中国国际贸易促进委员会专利商标事务所 CCPIT PATENT AND TRADEMARK LAW OFFICE; 中国北京市 西城区阜成门外大街2号万通新世界广场8层 8th Floor, Vantone New World Plaza, 2 Fuchengmenwai Street, Xicheng District Beijing 100037, CN
Priority Data:
201710776469.801.09.2017CN
201810827090.X25.07.2018CN
201810829497.625.07.2018CN
201810829499.525.07.2018CN
Title (EN) ELECTRICAL DEVICE AND ELECTRICAL APPARATUS
(FR) DISPOSITIF ÉLECTRIQUE ET APPAREIL ÉLECTRIQUE
(ZH) 电气器件以及电气装置
Abstract:
(EN) The present application relates to an electrical device and an electrical apparatus. The provided electrical device comprises: a semiconductor substrate on which a power semiconductor element is formed, a control electrode and a first current electrode of the power semiconductor element being disposed on a surface of the substrate; a printed circuit board on which a drive module for driving the power semiconductor element is disposed, the drive module comprising at least one first switch element, and each first switch element comprising a control terminal and a current terminal; a first conductive block disposed between the substrate and the printed circuit board to provide an electrical connection to the first current electrode; one or more connection members, each of which passes through the first conductive block in such a manner that the connection member is electrically isolated from the first conductive block, and is connected to a part of the control electrode, and associated with a corresponding first switch element; and one or more first spring components, each of which is disposed between a corresponding connection member and the first switch element associated with the corresponding connection member, so that a first current terminal of the first switch element is electrically connected to a part of the control electrode by means of the connection member.
(FR) La présente invention concerne un dispositif électrique et un appareil électrique. Le dispositif électrique selon l'invention comprend : un substrat semi-conducteur sur lequel un élément semi-conducteur de puissance est formé, une électrode de commande et une première électrode de courant de l'élément semi-conducteur de puissance étant disposées sur une surface du substrat ; une carte de circuit imprimé sur laquelle est disposé un module de commande pour commander l'élément semi-conducteur de puissance, le module de commande comprenant au moins un premier élément de commutation, et chaque premier élément de commutation comprenant une borne de commande et une borne de courant ; un premier bloc conducteur disposé entre le substrat et la carte de circuit imprimé pour fournir une connexion électrique à la première électrode de courant ; un ou plusieurs éléments de connexion, dont chacun passe à travers le premier bloc conducteur de telle sorte que l'élément de connexion est électroisolé du premier bloc conducteur, et est relié à une partie de l'électrode de commande, et associé à un premier élément de commutation correspondant ; et un ou plusieurs premiers composants de ressort, chacun étant disposé entre un élément de connexion correspondant et le premier élément de commutation associé à l'élément de connexion correspondant, de sorte qu'une première borne de courant du premier élément de commutation soit électroconnectée à une partie de l'électrode de commande au moyen de l'élément de connexion.
(ZH) 本公开涉及电气器件以及电气装置。提供一种电气器件,包括:其上形成了功率半导体元件的半导体基板,在该基板的表面上布置功率半导体元件的控制电极和第一电流电极;印刷电路板,其上布置有驱动功率半导体元件的驱动模块,驱动模块包括至少一个第一开关元件,第一开关元件包括控制端子和电流端子;第一导电块,置于所述基板和印刷电路板之间,提供到第一电流电极的电连接;一个或多个连接件,与第一导电块电隔离地穿过第一导电块并连接到控制电极的一部分,连接件与相应的第一开关元件关联;一个或多个第一弹簧部件,置于对应的连接件和与对应的连接件关联的第一开关元件之间,使第一开关元件的第一电流端子通过连接件电连接到控制电极的一部分。
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Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JO, JP, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: Chinese (ZH)
Filing Language: Chinese (ZH)